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From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
The Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
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KLA Names Michael R. McMullen to Board of Directors
July 25, 2023 | KLAEstimated reading time: Less than a minute

KLA Corporation announced the appointment of Michael R. McMullen to its Board of Directors and Compensation and Talent Committee.
McMullen was named President of Agilent Technologies in 2014 and Chief Executive Officer in 2015 and has been with the company and its predecessor, Hewlett-Packard, for more than 30 years.
"We are excited to welcome Mike McMullen to the KLA board," commented Robert M. Calderoni, chair of the board of KLA. "Mike's extensive experience in driving growth at a global scale in complex multinational equipment businesses makes him an ideal fit for KLA's board as we execute our long-term growth strategies."
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Sweeney Ng - CEE PCBSuggested Items
Materials and Manufacturing for the AI Era: The Next PCB Frontier
08/08/2025 | Edy Yu, Chief Editor, ECIO, and the I-Connect007 Editorial TeamAI is pushing hardware to its limits, and the bottleneck isn’t design anymore—it’s materials. Next-generation AI servers aren’t just heavier on layer counts. They demand better materials to handle the speed, heat, and signal integrity requirements of 400G, 800G, and even 1.6T Ethernet systems. Many server motherboards are already 32–36 layers. For the next wave of 1.6T-capable boards, expect 40–50 layers, which must maintain high-frequency performance without degrading signal quality.
Nvidia’s PCB Vendor Victory Giant Plans to Raise Funds in Hong Kong IPO
08/07/2025 | I-Connect007 Editorial TeamNvidia supplier Victory Giant Technology, based in Huizhou, Guangdong, China, released plans at the end of July for a Hong Kong share offering. The move came after regulators eased fundraising rules to support high-tech companies, the South China Morning Post reported.
Getting Our ‘Fil’ of Design Constraint Techniques
08/07/2025 | Andy Shaughnessy, Design007 MagazineFilbert Arzola is a principal electrical engineer at Raytheon SAS and an instructor who teaches one of the few classes (that I know of) that focuses on setting design constraints. I asked Fil to share his thoughts on design constraints: the factors involved, the various trade-offs, and his best practices for optimizing constraints for your particular design. As Fil says, “Everything about a PCB is a constraint.”
Inside the AI Hardware Boom: Servers, Substrates and Advanced Packaging
08/07/2025 | Edy Yu, Printed Circuit Information, China, and Marcy LaRont, I-Connect007AI is rewriting the hardware playbook, marrying complex software and algorithms to run and improve machine and equipment operations. Sorting through, managing, and utilizing massive amounts of data takes tremendous data storage and processing power. Enter the new generation of supercomputers and data servers. The data servers being built today are not your momma’s server, as they say.
Summer Vacation at AT&S: Welcome to World of Experience
08/06/2025 | AT&SWelcome to the cool world of microelectronics. At AT&S, high-quality IC substrates and printed circuit boards are produced for prominent customers from the high-tech world, which have essential functions in smartphones, smartwatches and laptops and are also indispensable in airplanes, electric cars, satellites and many applications of digital life.