-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Legislative Outlook: Helping or Hurting?
This month, we examine the rules and laws shaping the current global business landscape and how these factors may open some doors but may also complicate business operations, making profitability more challenging.
Advancing the Advanced Materials Discussion
Moore’s Law is no more, and the advanced material solutions to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
Inventing the Future With SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
Talking with Tamara: Floor Planning Policies
September 4, 2025 | Andy Shaughnessy, Design007 MagazineEstimated reading time: 1 minute

Tamara Jovanovic is an electrical engineer with Masimo, a medical equipment manufacturer. She’s been designing PCBs for seven years and earned a master’s degree in electrical engineering in 2022. I asked Tamara to share her thoughts on floor planning—the challenges, techniques, and advice for designers setting up floor planning strategies.
Andy Shaughnessy: What is the objective of floor planning during PCB design?
Tamara Jovanovic: For any new circuit board design, the floor planning step typically occurs when the schematic is finalized (or nearly finalized) and before layout and routing begin. The objective of floor planning is to ensure that what you're designing is most optimized from the signal integrity perspective—ESD/EMI, as well as mechanical and thermal.
The idea is to place large components on the circuit board first, especially those that interact with mechanical features of the design and to isolate noise sensitivity on the board. This process is typically carried out by the PCB design engineer in collaboration with a mechanical engineer, using design tools to place components and align/mate them with mechanical elements, as well as to make sure there is enough separation for sensitive signals that need proper isolation/grounding.
Shaughnessy: What factors figure into the floor planning process?
Jovanovic: First and foremost, designers need to make sure that they're choosing components that will fit in the final product's mechanical enclosure and on the board shape previously agreed upon. It's also important to have an early plan for the board's layer stackup, or how many layers the board shall have and what each layer will be designated for (i.e., signal or power/ground).
Most of the time, the first components that are placed on the board are main design elements such as main processors and power ICs, which often require special design considerations and proper thermal management. Next, we have components that carry sensitive signals, such as clocks, crystals and RF parts. Those usually require careful handling when it comes to grounding and impedance, so it's always good practice to plan their placement early and ensure they are properly isolated.
To continue reading this interview, which originally appeared in the August 2025 edition of Design007 Magazine, click here.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Peters, Starteam, and Würth Elektronik Team Up For Digital Coating Technology
10/23/2025 | PetersUnder this heading, the PCB manufacturers Starteam and Würth Elektronik, along with Peters as inkjet coating supplier, have taken the initiative and worked together for months in trusting and target-oriented cooperation, to promote this innovative digital coating technology for solder resists and establish it on the market.
AI Triggers Next Paradigm Shift in PDN
10/23/2025 | Istvan Novak, SamtecArtificial intelligence (AI), together with machine learning (ML), is creating an unprecedented surge of computing and networking infrastructure needs. This, in turn, has dramatically increased the power consumption of computing and networking chips.
SEMICON Japan 2025 to Spotlight Sustainability in AI and Semiconductor Innovation
10/22/2025 | SEMISEMICON Japan 2025, the largest gathering of leaders from the microelectronics manufacturing supply chain in Japan, will bring together more than 1,200 exhibitors showcasing semiconductor solutions from December 17-19 at Tokyo Big Sight.
Zuken Announces ZIW Americas 2026 in Dallas
10/21/2025 | ZukenZuken USA, Inc., a global leader in electrical and electronic design automation, announced Zuken Innovation World (ZIW) Americas 2026, the company’s premier global conference dedicated to advancing the future of electrical and electronic product design. ZIW 2026 will be held June 9-11 in Dallas, Texas.
Keysight Completes Acquisition of Synopsys’ Optical Solutions Group and Ansys’ PowerArtist
10/17/2025 | Keysight Technologies, Inc.Keysight Technologies, Inc., announced the completion of its acquisitions of the Optical Solutions Group from Synopsys, Inc., and PowerArtist from Ansys, Inc.