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Laser Photonics Propels R&D Efforts in Wafer Marking

02/04/2025 | BUSINESS WIRE
Laser Photonics Corporation, a leading global developer of industrial laser systems for cleaning and other material processing applications, and its recently acquired subsidiary, Control Micro Systems, Inc. (CMS Laser), announced the expansion of their Laser Wafer Marking technology research and development program.

EXTOLL Collaborates with BeammWave and GlobalFoundries as Key SerDes IP Partner for Lowest Power High-Speed ASIC

02/04/2025 | GlobalFoundries
EXTOLL, a leading provider of high-speed and ultra-low-power SerDes and Chiplet connectivity, has been selected by BeammWave, an innovation leader in mmWave 5G/6G digital beamforming, as a key SerDes IP supplier for its next gen communication ASIC development portfolio on GlobalFoundries’ (GF) 22nm FD-SOI process technology, 22FDX®.

Solderstar to Present Advanced Profiling Solutions at IPC APEX EXPO 2025

02/04/2025 | SolderStar
Solderstar, a leading provider of profiling solutions for the electronics manufacturing industry, will exhibit at IPC APEX EXPO 2025, which will take place March 18-20, 2025, at the Anaheim Convention Center in California.

Rehm Thermal Systems: Future Technologies for Coating, Dispensing and Vapour Phase Soldering Live at IPC APEX EXPO 2025

02/04/2025 | Rehm Thermal Systems
IPC APEX EXPO 2024, which takes place from 18 to 20 March at the Anaheim Convention Center in California, is the largest and most important trade fair for electronics manufacturing in North America.

Koh Young Highlights Inspection Solutions at IPC APEX EXPO 2025

02/04/2025 | Koh Young
Koh Young, the industry leader in True3D measurement-based inspection solutions and the exclusive Premier Sponsor of IPC APEX EXPO 2025, invites electronics manufacturers to Booth 2130 for live demonstrations of its award-winning inspection technologies.
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