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Podcast Review: On the Line with… Designing for Reality

05/09/2024 | Duane Benson, Positive Edge LLC
As a technologist, if I were forced to come up with just one recurring theme that I might call a professional “nemesis,” it would be the difference between theory and reality. A lot of technology we have at our disposal works well in theory but falls short when reality hits. That’s not the only reason I chose to listen to and review On the Line with… Designing for Reality, featuring a series of conversations with ASC Sunstone’s Matt Stevenson, but it certainly helped that the title caught my eye.

EMA Webinar: Next Generation MCAD/ECAD for SOLIDWORKS

05/09/2024 | EMA Design Automation
Learn how the MCAD and ECAD experts at Hawk Ridge and EMA can help you solve your MCAD/ECAD integration challenges with this unique collaboration environment.

Sondrel Awarded New Video Processor ASIC Design and Supply Contract

05/09/2024 | Sondrel
Sondrel, a leading provider of ultra-complex custom chips for leading global technology brands, is pleased to announce that it has won a major ASIC design and supply contract for a next generation, video processing chip.

Connect the Dots: Designing for Reality—The Pre-Manufacturing Process

05/08/2024 | Matt Stevenson -- Column: Connect the Dots
I have been working with Nolan Johnson on a podcast series about designing PCBs for the reality of manufacturing. By sharing lessons learned over a long career in the PCB industry, we hope to shorten learning curves and help designers produce better boards with less hassle and rework. Episode 2 deals with the electronic pre-manufacturing process. Moving from CAD (computer-aided design) to CAM (computer-aided manufacturing) is a key step in PCB manufacturing. CAM turns digital designs into instructions that machines can use to actually build the PCB.

Indium Corporation to Showcase HIA Materials at ECTC

05/07/2024 | Indium Corporation
As an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 74th Electronic Components and Technology Conference (ECTC), May 28‒31, in Denver, Colorado.
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