The Marketing Minute: A Brand Visibility Playbook—Get Seen, Heard, and Remembered
American Made Advocacy: Supporting the Entire PCB Ecosystem—Materials to OEMs
Marcy's Musings: The Hole Truth—Via Integrity in an HDI World
MKS’ Atotech to Participate in IPCA Expo 2023
September 14, 2023 | MKS’ AtotechEstimated reading time: Less than a minute
MKS’ Atotech, a leading surface finishing brand of MKS Instruments, will participate in the upcoming IPCA Expo at Bangalore International Exhibition Centre (BIEC) and showcase its latest PCB manufacturing solutions from September 13 – 15.
At booth EF 51 Atotech® product experts will be introducing the combination of wet chemical processes, production equipment (plating lines, lasers, auxiliaries) and software solutions. A spotlight is set on the various solutions available for e-mobility e.g. BEV, HEV and PHEV batteries and other components. This year highlights include:
- V-Plate®: Vertical continuous Cu plating technology of choice for advanced HDI & IC substrate
- GeodeTM: High-precision CO2 via drilling for HDI PCB manufacturing and IC packaging
- CapstoneTM: Flex PCB UV drilling tool for high-performance breakthrough productivity
- CupraEtch® DF 8000: Low etch rate and etch depth dry film pretreatment
- Noviganth® AF 76: High build self-accelerating electroless copper
- OS Tech® SIT 2: The OSP solution combinable with ENIG
- Stannopure® PF 10: High-speed green tin process for lead frames and connectors
- InPro® MVF 2: Next-generation blind micro via filling in VCP for HDI production
Share on:
Suggested Items
The Evolution of Picosecond Laser Drilling
06/19/2025 | Marcy LaRont, PCB007 MagazineIs it hard to imagine a single laser pulse reduced not only from nanoseconds to picoseconds in its pulse duration, but even to femtoseconds? Well, buckle up because it seems we are there. In this interview, Dr. Stefan Rung, technical director of laser machines at Schmoll Maschinen GmbH, traces the technology trajectory of the laser drill from the CO2 laser to cutting-edge picosecond and hybrid laser drilling systems, highlighting the benefits and limitations of each method, and demonstrating how laser innovations are shaping the future of PCB fabrication.
Day 2: More Cutting-edge Insights at the EIPC Summer Conference
06/18/2025 | Pete Starkey, I-Connect007The European Institute for the PCB Community (EIPC) summer conference took place this year in Edinburgh, Scotland, June 3-4. This is the third of three articles on the conference. The other two cover Day 1’s sessions and the opening keynote speech. Below is a recap of the second day’s sessions.
Day 1: Cutting Edge Insights at the EIPC Summer Conference
06/17/2025 | Pete Starkey, I-Connect007The European Institute for the PCB Community (EIPC) Summer Conference took place this year in Edinburgh, Scotland, June 3-4. This is the second of three articles on the conference. The other two cover the keynote speeches and Day 2 of the technical conference. Below is a recap of the first day’s sessions.
Preventing Surface Prep Defects and Ensuring Reliability
06/10/2025 | Marcy LaRont, PCB007 MagazineIn printed circuit board (PCB) fabrication, surface preparation is a critical process that ensures strong adhesion, reliable plating, and long-term product performance. Without proper surface treatment, manufacturers may encounter defects such as delamination, poor solder mask adhesion, and plating failures. This article examines key surface preparation techniques, common defects resulting from improper processes, and real-world case studies that illustrate best practices.
RF PCB Design Tips and Tricks
05/08/2025 | Cherie Litson, EPTAC MIT CID/CID+There are many great books, videos, and information online about designing PCBs for RF circuits. A few of my favorite RF sources are Hans Rosenberg, Stephen Chavez, and Rick Hartley, but there are many more. These PCB design engineers have a very good perspective on what it takes to take an RF design from schematic concept to PCB layout.
Copyright © 2025 I-Connect007 | IPC Publishing Group Inc. All rights reserved.
Log in