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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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MKS’ Atotech to Participate in IPCA Expo 2023
September 14, 2023 | MKS’ AtotechEstimated reading time: Less than a minute
MKS’ Atotech, a leading surface finishing brand of MKS Instruments, will participate in the upcoming IPCA Expo at Bangalore International Exhibition Centre (BIEC) and showcase its latest PCB manufacturing solutions from September 13 – 15.
At booth EF 51 Atotech® product experts will be introducing the combination of wet chemical processes, production equipment (plating lines, lasers, auxiliaries) and software solutions. A spotlight is set on the various solutions available for e-mobility e.g. BEV, HEV and PHEV batteries and other components. This year highlights include:
- V-Plate®: Vertical continuous Cu plating technology of choice for advanced HDI & IC substrate
- GeodeTM: High-precision CO2 via drilling for HDI PCB manufacturing and IC packaging
- CapstoneTM: Flex PCB UV drilling tool for high-performance breakthrough productivity
- CupraEtch® DF 8000: Low etch rate and etch depth dry film pretreatment
- Noviganth® AF 76: High build self-accelerating electroless copper
- OS Tech® SIT 2: The OSP solution combinable with ENIG
- Stannopure® PF 10: High-speed green tin process for lead frames and connectors
- InPro® MVF 2: Next-generation blind micro via filling in VCP for HDI production
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Julia McCaffrey - NCAB GroupSuggested Items
Nortech Systems Launches Power over Fiber Technology Platform for EMI-Sensitive Applications
04/08/2026 | Globe NewswireNortech Systems Incorporated, a leading provider of design and manufacturing solutions for complex electromedical devices and electromechanical systems, has announced the launch of its Power over Fiber technology platform.
Flexible Thinking: Designing Flex Circuits for Dynamic Reliability
04/09/2026 | Joe Fjelstad -- Column: Flexible ThinkingFlex circuits flex. No surprises there. However, they are also very commonly designed into products because they are thin and offer consistent thickness and dielectric properties, attributes highly prized by present-day product designers of personal electronics. This would include smartphones and, increasingly, wearable electronics for medical monitoring and even fashion.
Understanding Tolerances in Flexible Circuit Design
04/01/2026 | Chris Clark, Flexible Circuit TechnologiesThe challenge with cumulative tolerances is meeting the dimensional requirements for items dimensioned on a drawing or specification for a flexible or rigid-flex circuit. It is critical to understand the fabrication processes and how features are defined when creating your tolerance requirements.
Target Condition: An Exploration of Flooding PCB Layers
04/02/2026 | Kelly Dack -- Column: Target ConditionThe concept of flooding PCB layers with copper has been around for so long, you’d think we’d have it mastered. We haven’t. (Oh, and by “we,” I mean design engineers and the software tools we depend on.) Years ago, PCB artwork was created by hand using light tables, with tape applied to Mylar. Signals were slow, traces were relatively wide, and high-current paths were simply “beefed up” with wider copper. Signal integrity wasn’t yet a driving concern. Today, solid return paths are fundamental to robust design. We understand the importance of continuous reference planes for signal integrity and EMI control.
New, Greener Solutions for Etch: Novel Copper Extraction
03/30/2026 | Richard Nichols, GreenSource Engineering“Novel” is a typical marketing phrase that implies new and unique, but often “novel” actually means an established technology being applied to a new field or application. This, in turn, is often driven by newly relevant external motivation. GreenSource has been working on just such a solution: novel copper extraction, offering a better and greener alternative to traditional LLE control systems for cupric chloride etch.