The Marketing Minute: Go Big or Go Home—Long-form Content Is Your Brand’s Best Friend
Schmoll: Decades of Technology Evolution
It’s Only Common Sense: The Danger of Overthinking
MediaTek Successfully Develops First Chip Using TSMC's 3nm Process, Set for Volume Production in 2024
September 14, 2023 | MediaTekEstimated reading time: 1 minute
MediaTek and TSMC announced that MediaTek has successfully developed its first chip using TSMC's leading-edge 3nm technology, taping out MediaTek’s flagship Dimensity system-on-chip (SoC) with volume production expected next year. This marks a significant milestone in the long-standing strategic partnership between MediaTek and TSMC, with both companies taking full advantage of their strengths in chip design and manufacturing to jointly create flagship SoCs with high performance and low power features, empowering global end devices.
“We are committed to our vision of using the world’s most advanced technology to create cutting edge products that improve our lives in meaningful ways,” said Joe Chen, President of MediaTek. “TSMC's consistent and high-quality manufacturing capabilities enable MediaTek to fully demonstrate its superior design in flagship chipsets, offering the highest performance and quality solutions to our global customers and enhancing the user experience in the flagship market.”
“This collaboration between MediaTek and TSMC on MediaTek’s Dimensity SoC means the power of the industry’s most advanced semiconductor process technology can be as accessible as the smartphone in your pocket,” said Dr. Cliff Hou, Senior Vice President of Europe and Asia Sales at TSMC. “Throughout the years, we have worked closely with MediaTek to bring numerous significant innovations to the market and are honored to continue our partnership into the 3nm generation and beyond.”
TSMC’s 3nm process technology provides enhanced performance, power, and yield, in addition to complete platform support for both high performance computing and mobile applications. Compared with TSMC’s N5 process, TSMC’s 3nm technology currently offers as much as 18% speed improvement at same power, or 32% power reduction at same speed, and approximately 60% increase in logic density.
MediaTek's Dimensity SoCs, built with industry-leading process technology, are designed to meet the ever-increasing user experience requirements for mobile computing, high-speed connectivity, artificial intelligence, and multimedia. MediaTek’s first flagship chipset using TSMC’s 3nm process is expected to empower smartphones, tablets, intelligent cars and various other devices starting in the second half of 2024.
Share on:
Suggested Items
Foxconn Chairman Young Liu to Deliver Keynote at COMPUTEX 2025
03/28/2025 | PRNewswireTAITRA (Taiwan External Trade Development Council), announced that Young Liu, Chairman of Hon Hai Technology Group (Foxconn), is invited to be the speaker at COMPUTEX 2025 Keynote, sharing his vision on three intelligent platforms driving industry transformation and the role of robotics in factories of the future.
MVTec, Pepperl+Fuchs Enter into Technology Partnership
03/27/2025 | MVTecMVTec Software GmbH and Pepperl+Fuchs are stepping up their technological collaboration in the field of machine vision. As part of this, Pepperl+Fuchs joined the MVTec Technology Partner program at the beginning of 2025.
DuPont Announces Board of Directors for the Planned Independent Electronics Company
03/27/2025 | PRNewswireDuPont announced the members of the future board of directors for the independent Electronics public company that will be created following its intended spin-off from DuPont.
HARTING 3D-Circuits Leads 3D-MID Innovation: Transforming Consumer Electronics with Advanced Technology
03/27/2025 | PRNewswireThe consumer electronics industry is experiencing a remarkable transformation, propelled by rapid technological advancements and an increasing demand for compact, efficient, and multifunctional devices. Central to this evolution is 3D-MID (Three-Dimensional Mechatronic Integrated Devices) technology, which redefines design standards and drives innovation.
Point2 Technology, Sumitomo Electric Industries New Partnership
03/26/2025 | Point2 TechnologyPoint2 Technology, a leading provider of ultra-low-power, low-latency mixed-signal SoC solutions for multi-terabit interconnect, and Sumitomo Electric Industries, Ltd. (SEI), a global leader in high-speed communication systems, announced the signing of a Memorandum of Understanding (MOU) to collaborate on the development of SEI’s next-generation 25G optical transceiver modules.