Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

Ansys’ Collaboration with Schrödinger will Accelerate Materials Development with Unprecedented Multiscale Simulation

05/09/2024 | ANSYS
Ansys and Schrödinger are collaborating to deliver an ICME approach that bridges the gap between materials discovery and product development.

Ansys Announces Q1 Financial Results

05/03/2024 | ANSYS
ANSYS, Inc. reported first quarter 2024 revenue of $466.6 million, a decrease of 8% in reported and constant currency, when compared to the first quarter of 2023.

TSMC Certifies Ansys Multiphysics Platforms, Enabling Next-Gen AI and HPC Chips

04/30/2024 | PRNewswire
Ansys announced the certification of its power integrity platforms for TSMC's N2 technology full production release. Both Ansys RedHawk-SC and Ansys Totem are certified for power integrity signoff on the N2 process, delivering significant speed and power advantages for high performance computing, mobile chips, and 3D-IC designs.

Ansys, TSMC Enable a Multiphysics Platform for Optics and Photonics, Addressing Needs of AI, HPC Silicon Systems

04/25/2024 | PRNewswire
Ansys announced a collaboration with TSMC on multiphysics software for TSMC's Compact Universal Photonic Engines (COUPE). COUPE is a cutting-edge Silicon Photonics (SiPh) integration system and Co-Packaged Optics platform that mitigates coupling loss while significantly accelerating chip-to-chip and machine-to-machine communication.

Ansys Joins BAE Systems’ Mission Advantage Program to Advance Digital Engineering Across US Department of Defense

04/16/2024 | ANSYS
Ansys announced it is working with BAE Systems, Inc., to accelerate the adoption of digital engineering and MBSE across the Department of Defense (DoD).
Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in