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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
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Real Time with... productronica 2023: Dennis Pusch Shares Features of Schmoll's Direct Imaging System
November 29, 2023 | Real Time with...productronicaEstimated reading time: Less than a minute
In this interview, Pete Starkey speaks with Dennis Pusch of Schmoll Maschinen and Kurt Palmer of Burkle North America about Schmoll's newest DI system. Dedicated to fineline imaging, Schmoll’s MDI Ultra supports PCB manufacturers moving into IC substrate manufacturing.
If you were unable to attend productronica 2023, don't worry. We're bringing you coverage of many of the week's events in Munich.
Watch this interview below or click here to view on our Real Time with... productronica 2023 show page.
Suggested Items
Nolan's Notes: The Next Killer App in Component Manufacturing
05/02/2025 | Nolan Johnson -- Column: Nolan's NotesFor quite a while, I’ve been wondering what the next “killer app” will be in electronics manufacturing and why it has been so long since the last disruptive change in EMS. I believe the answer lies in artificial intelligence, which has exploded as the next disruptor.
IPC APEX EXPO 2025: We’ve Got It Covered
04/01/2025 | I-Connect007 Editorial TeamIPC APEX EXPO is the largest electronics manufacturing trade show in North America, bringing together professionals from all sectors of the supply chain to educate, network, and share their products and services. We’ve put all our coverage of the show in one easy-to-find location. Just click on “Videos,” “Show Coverage” and “Photos” to find what you’re looking for. Check back regularly as more content is added. You won’t want to miss any of our unique coverage.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
02/14/2025 | Andy Shaughnessy, Design007 MagazineShow season is upon us. Recently, Marcy LaRont and I attended DesignCon’s 30th anniversary show, and the expo floor was packed for almost the entire time. Show managers went all out, hosting a welcome party that included a rocking DJ. Much of the event revolved around AI and how to implement it. Is your company utilizing AI now? I’m featuring an abundance of articles from the past week, covering everything from DesignCon presentations to the benefits of volunteering for an IPC committee. If you’ve ever thought about joining a relevant committee, IPC is always looking for “new blood.”
SMTA Chapters: A Bold, New Direction
02/05/2025 | Nolan Johnson, SMT007 MagazineSince joining SMTA as director of chapter relations about seven months ago, Alicia Yao has had some immediate and definite impact. Her background includes management in the luxury product retail space which, if one reflects on it, provides philosophical parallels to customer relationship building in electronics assembly.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
12/13/2024 | Andy Shaughnessy, I-Connect007This week, Peter Tranitz discusses the upcoming Pan-European Electronics Design Conference, set for Jan. 29-30 in Vienna, Austria. Pete Starkey brings us a review of the most recent EIPC Technical Snapshot webinar, which featured a global PCB maker update by Dr. Hayao Nakahara. Don't miss our interview with Manfred Huschka, who explains how companies can begin their own China Plus One plan. Stan Farnsworth breaks down photonic soldering and discusses its use in soldering materials that are not typically compatible. I also enjoyed Dan Beaulieu’s discussion on the value of consistency, and why just showing up for work is half the battle, especially in an inconsistent, evolving industry like ours.