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We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
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Kick Off the New Year With the Winter Issue of IPC Community!
January 15, 2024 | Michelle Te, I-Connect007Estimated reading time: 1 minute

We’ve compiled the best stories from around the electronics manufacturing industry and packed them into another issue of IPC Community. IPC staff and volunteers work on behalf of the industry to deliver timely and relevant content—from standards updates to important networking events—that impact the work we do each day.
What’s new this time?
- Joe Russeau is a test engineer by day and a cattle farmer by night (or early morning!) blending his interest in electronics with his passion for the land.
- It was a busy event season, and we’ve got reviews from several important events around the world, from the standards work of A-Teams at Gnomeapalooza to the world’s largest electronics show (productronica) and IPC Day Romania, where history meets cutting-edge technology.
- Find out why Shawn DuBravac states that “nearshoring is paving the way for a more interconnected and robust global economy.”
- How are standards created? It starts with a special committee of industry experts who gather as the Technical Activities Executive Committee Global team to get the ball rolling.
The issue also includes upcoming class schedules designed just for you, updates on the latest standards released, profiles on BOSTONtec and American Standard Circuits, and in-depth coverage of the IPC certification process—try 123,000 certifications in one year!
See your friends—and make some new ones— in the pages of IPC Community. Read it here.
Suggested Items
IPC Hall of Fame Spotlight Series: Highlighting Walt Custer
04/09/2025 | Dan Feinberg, I-Connect007This Hall of Fame spotlight features a long-time associate of mine, Walt Custer. Now retired, Walt is well known in the industry for his decades of work as part of Custer Consulting Group, presenting his market research and business analyses at trade shows and conferences around the globe. As I mentioned in my spotlight on Gene Weiner, Walt and I were in that group that reported to Gene back in the old Dynachem days. Under Gene’s tutelage, we became deeply involved in IPC and were eventually honored with the Hall of Fame award.
Real Time with... IPC APEX EXPO 2025: Innovating Design—IPC's Vision for the Future
04/09/2025 | Real Time with...IPC APEX EXPOPeter Tranitz leads the IPC Design Initiative, which aims to enhance design offerings and engage the community, including the Design Leadership Council guiding future strategies. Peter talks about the IPC-hosted European electronics design conference, featuring peer-reviewed content and global participation. IPC's design initiative also tackles challenges, such as semiconductor scaling and AI integration, focusing on innovative co-design solutions.
TRI: Inspection Innovations at Focus on PCB Expo
04/09/2025 | TRII-Tronik, TRI's distributor, will showcase cutting-edge AI-powered inspection solutions at Focus on PCB 2025, taking place at Fiera di Vicenza, Italy, from May 21–22, 2025.
Real Time with... IPC APEX EXPO 2025: Exploring Ventec's Innovations
04/09/2025 | Real Time with...IPC APEX EXPOMark Goodwin highlights Ventec's global distribution network and recent expansions in service and equipment offerings. He emphasizes the company's expertise in coating technology for thermal management, specialized materials, and its agility in creating customized solutions for customers.
Real Time with... IPC APEX EXPO 2025: Takaya Focusing On Customer Engagement
04/08/2025 | Real Time with...IPC APEX EXPODavid Levine discusses the two new Takaya flying probe tester models on the show floor this year. The advanced features include an innovative liquid lens technology for improved focus in industrial applications, and zero impact probes for RF boards. Real map technology enhances testing accuracy, while eighth generation system improvements even offer remote viewing. The integration of potential for AI with test data is also discussed.