Global Citizenship: Redefining Connection and Responsibility in Digital Transformation
The Marketing Minute: Strategic Short-form Content Builds Brand Momentum
SMT Perspectives and Prospects: Artificial Intelligence, Part 5: Brain, Mind, Intelligence
Exploring Cold Milling as an Alternative PCB Component Removal Method
January 24, 2024 | Bob Wettermann, BEST Inc.Estimated reading time: Less than a minute
When a PCB undergoes multiple heat cycles, inherent risks emerge, primarily due to the expansion and contraction of materials. This thermal stress can induce various issues, including delamination, warping, compromised solder joints, and damage to heat-sensitive components like integrated circuits or capacitors.
To counter these risks, one approach involves a unique process called "cold milling," designed to mitigate the adverse effects of additional thermal stress. Unlike traditional methods involving direct heat application, this solution utilizes a laser-guided precision mill to remove components. This ESD-safe process includes a vacuum nozzle that simultaneously removes debris during the milling process, ensuring cleanliness.
The genesis of “cold milling” stems from a customer's challenge with removing underfilled BGAs. They encountered issues with underfill leaching into the adjacent solder during reflow, causing solder shorts. By utilizing this cold milling process, we were able to remove the component without applying heat and place a new component in its place resulting in a yield >90% and a successful solution for the customer.
To read this entire article, which appeared in the January 2024 issue of SMT007 Magazine, click here.
Share on:
Suggested Items
EIPC Summer Conference 2025: PCB Innovation in Edinburgh
04/18/2025 | EIPCEIPC have very wisely selected this wonderful city in Scotland as the venue for their Summer Conference on June 3-4. Whilst delegates will be distilling the proven information imparted by the speakers in the day, in the evening they will be free spirits at the Conference Dinner.
Saki America, Appoints Mario Ramírez Galindo as Project Engineer in Mexico
04/17/2025 | Saki America,Saki America, Inc., an innovator in the field of automated optical and X-ray inspection equipment, is pleased to announce the appointment of Mario Ramírez Galindo as Project Engineer in Mexico. In this role, Mario will support Saki’s customers by providing technical expertise, process optimization, and project management to enhance manufacturing efficiency and inspection accuracy.
KOKI Announces Upcoming Webinar on Solder Voiding – Causes and Remedies
04/16/2025 | KOKIKOKI, a global leader in advanced soldering materials and process optimization services, is pleased to announce its upcoming webinar, “Solder Voiding—Causes and Remedies,” which will take place on Tuesday, April 22, 2025, at 12:00 PM CDT. Jerome McIntyre, Regional Sales & Applications Engineer at KOKI Americas, will present this live session.
Smart and Compact Sensors with Edge-AI
04/16/2025 | FraunhoferA newly launched interdisciplinary research project involving universities of Brandenburg and research institutions is developing new technological approaches for better and more effective integration of artificial intelligence at the edges of IT networks, so-called “edges”.
ASMC 2025 Showcases AI and Emerging Technologies Shaping the Future of Semiconductor Manufacturing
04/16/2025 | SEMIThe 36th annual Advanced Semiconductor Manufacturing Conference (ASMC) 2025 will be held May 5-8, 2025, in Albany, New York, bringing together leaders in semiconductor manufacturing to explore cutting-edge advancements driving high-volume production and AI-powered innovation.