-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueComing to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
Box Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
SMTA Carolinas Chapter In-Person Technical Meeting to Improve SMT Quality with Accuracy and Force Validation
February 6, 2024 | SMTA Carolinas ChapterEstimated reading time: 1 minute
The Carolinas Chapter of the SMTA is hosting an evening dinner presentation on Thursday, February 22, 2024 from 6:00 - 8:00 pm ET at East West Charlotte in Mooresville, NC with CeTaQ General Manager Michael Sivigny, who will present on ways to improve SMT quality. Special thanks to our site sponsor, East West Manufacturing. Additional information about the event and the registration form is found at smta.org/events.
If you don't measure, you don't know. These are appropriate words for the application of statistical methods for measuring machine and process capabilities in SMT manufacturing. Only through diagnostic measurement and analysis of SMT equipment can quality performance improvement be realized. Measured mean values can be used to 'soft' calibrate machines to a higher level of accuracy than available through OEM standard calibrations.
With the complexity of highspeed automation combined with high accuracy requirements for product miniaturization, it is necessary to dig deeper with statistically significant data collection methods to understand and solve the root cause of sub-component machine failures which impact product quality.
When machines are allowed to run in 'maximum accuracy mode', they are more confident and capable of producing today's high reliability electronics with fewer defects. Defect contribution in each process step needs detailed analysis to reduce cost. When costs are minimized, the underlying inherent process efficiencies go way up which contributes to higher productivity and bottom-line profitability. The improvement effects of process optimization have several intrinsic benefits that can easily maintain high manufacturing productivity.
The presentation will discuss individual process step validation methods with real examples of improvement that contribute to DPMO reduction. Examples will include examples from laser marking, stencil printing, dispensing, and placement equipment. While each process step is characterized, the underlying objective is to verify OEM specifications and prove that machines are capable for intended quality performance. This allows engineers to streamline efforts and focus on other areas of process improvement. Register today as space is limited.
Suggested Items
TPCA Releases Guide to Help PCB Industry Achieve Low-Carbon Transformation
05/21/2024 | TPCAThe introduction of EU carbon tariffs, international brands committing to carbon neutrality, and the upcoming carbon fee in Taiwan means that carbon reduction is no longer just a slogan. Domestic and international pressures have turned carbon reduction into the golden grail of corporate sustainability.
Murata Obtains ISO 26262 Certification for Functional Safety in Automotive Applications
05/21/2024 | MurataMurata Manufacturing Co., Ltd., obtained the ISO 26262 development process certification for Functional Safety* Automotive ISO 26262 from the German third-party certifier SGS-TÜV Saar GmbH on February 13, 2024.
HBM3e Production Surge Expected to Make Up 35% of Advanced Process Wafer Input by End of 2024
05/20/2024 | TrendForceTrendForce reports that the three largest DRAM suppliers are increasing wafer input for advanced processes. Following a rise in memory contract prices, companies have boosted their capital investments, with capacity expansion focusing on the second half of this year.
Avnet Launches QCS6490 Vision-AI Development Kit
05/17/2024 | AvnetThe QCS6490 Vision-AI Development Kit from Avnet enables engineering teams to rapidly prototype hardware, application software and AI enablement for multi-camera, high-performance, Edge AI-enabled custom embedded products.
Standard of Excellence: Collaboration—The Right Path to Innovation
05/15/2024 | Anaya Vardya -- Column: Standard of ExcellenceNow more than ever, as new and innovative technologies for printed circuit boards are in demand, we need collaboration between PCB designers, fabricators, and assemblers. Close partnerships with PCB designers and assemblers are key to developing and producing PCBs with boards with new and innovative technology. These collaborative partnerships, along with the partnership with the end customers, are more critical than ever before.