Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"

Rachael Temple - Alltemated

Suggested Items

Imec Launches 300mm GaN Program to Develop Advanced Power Devices and Reduce Manufacturing Costs

10/13/2025 | Imec
Imec, a world-leading research and innovation hub in nanoelectronics and digital technologies, welcomes AIXTRON, GlobalFoundries, KLA Corporation, Synopsys, and Veeco as first partners in its 300mm gallium-nitride (GaN) open innovation program track for low- and high-voltage power electronics applications.

Renesas Powers 800 Volt Direct Current AI Data Center Architecture with Next-Generation Power Semiconductors

10/13/2025 | Renesas
Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, announced that it is supporting efficient power conversion and distribution for the 800 Volt Direct Current power architecture announced by NVIDIA, helping fuel the next wave of smarter, faster AI infrastructure.

Draganfly Enlisted by U.S. Army to Deliver Drones on Heels of Developing Drones for Border Security

10/10/2025 | Draganfly
Draganfly Inc., an industry-leading developer of drone solutions and systems, announced its selection by the U.S. Army to provide Flex FPV drone systems.

Draganfly Enlisted by U.S. Army to Deliver Drones on Heels of Developing Drones for Border Security

10/03/2025 | Cision
Draganfly Inc., an industry-leading developer of drone solutions and systems, announced its selection by the U.S. Army to provide Flex FPV drone systems.

Technica USA Advocates for PCBAA Membership Among Printed Circuit Assembly Customers

09/16/2025 | Technica USA
Technica USA is actively encouraging its printed circuit assembly customers to join the Printed Circuit Board Association of America (PCBAA), a leading industry organization advocating for increased domestic production of printed circuit boards (PCBs) and substrates.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in