Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

Rocket Lab Signs Preliminary Terms to Receive up to $23.9M in Funding Under the CHIPS Act to Expand Production of Semiconductors that Power Spacecraft

06/11/2024 | BUSINESS WIRE
Rocket Lab USA, Inc., a global leader in launch services and space systems, today announced the signing of a non-binding preliminary memorandum of terms (PMT) with the Department of Commerce that would see Rocket Lab receive up to $23.9M in direct funding under the CHIPS and Science Act.

ElevATE Semiconductor, GlobalFoundries Partner on High-Voltage Chips for Commercial and National Security Applications

06/11/2024 | GlobalFoundries
ElevATE Semiconductor and GlobalFoundries (GF) announced a manufacturing partnership for high-voltage chips produced at GF’s facility in Essex Junction, Vermont.

Governments Struggling With ‘Silicon-to-Systems Approach’

06/11/2024 | Chris Mitchell, IPC Vice President of Global Government Relations
What do you do when you don’t know what to do? That is the conundrum facing U.S. government officials overseeing billions of dollars in strategic investments in the domestic microelectronics industry. Enormous grants are beginning to flow to the chips sector, and after years of IPC advocacy and education efforts, policymakers have gained a clearer picture of the rest of the electronics supply chain, including everything chips depend on to function.

SIA Applauds CHIPS Act Incentives for Absolics Project in Georgia

05/30/2024 | SIA
The Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer applauding semiconductor manufacturing incentives announced by the U.S. Commerce Department and Absolics, an affiliate of the Korea-based SKC.

Worldwide AI Chips Revenue to Grow 33% in 2024

05/29/2024 | Gartner, Inc.
Revenue from AI semiconductors globally is expected to total $71 billion in 2024, an increase of 33% from 2023, according to the latest forecast from Gartner, Inc.
Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in