Dan’s Biz Bookshelf: ‘Abundance: How We Build a Better Future’
Trouble in Your Tank: In Complex Systems, Design Rules Aren’t Optional
It’s Only Common Sense: The Phone Is Still Your Competitive Advantage
Hirose Launches Solution Partner Network to Address Changing Design Challenges
May 6, 2024 | HiroseEstimated reading time: 1 minute
Hirose, a leader in the design and manufacturing of innovative connector solutions, has established a Solution Partner Network that enables OEMs to quickly explore product design, specialty IP, and component fulfillment options that best suit their needs.
The Solution Partner Network offers OEMs a competitive advantage. OEMs can easily expand their design and manufacturing resources thru a vetted channel to ultimately improve product performance, reduce costs and improve time-to-market. From quick turn prototyping, to designing for harsh environments, to scaling for manufacturing, Hirose’s Solution Partner Network addresses intricate design problems with tailored solutions that meet unique customer needs.
The Solution Partner Network is a strategic collaboration comprising Hirose, eight premier design partners with various product development core competencies and specialty IP, and Hirose’s eight distribution partners with expertise in logistics and fulfillment. The network enables OEMs to explore Hirose’s innovative connector solutions, various subsystem solutions from Hirose’s design partners, and peace of mind in component fulfillment from a Hirose distribution partner. Connect with Hirose, and explore design, specialty IP, and logistics options through Hirose’s new Solution Partner Network.
“Through the Solution Partner Network, OEMs can tap into a wealth of expertise, resources, and collaborative opportunities that will drive success in today's rapidly evolving marketplace,” said Pete Lais, Assistance VP of Product Management at Hirose Electric USA.
Connect with Hirose to explore Hirose’s innovative connector solutions, various subsystem and specialty IP solutions from design partners, and simplified component fulfillment from a trusted Hirose distributor.
Share on:
Subscribe
Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.
Subscribe now to stay informed, competitive, and connected.
Suggested Items
Dragonfly Energy Secures Additional Nevada Tech Hub Funding
05/07/2026 | Globe NewswireDragonfly Energy Holdings Corp., an industry leader in energy storage and maker of Battle Born Batteries®, announced it has been selected for a second consecutive round of funding through the Nevada Tech Hub.
Designing Without a Rulebook: When Engineering Becomes Innovation
05/05/2026 | Stephen V. Chavez, Siemens EDAWhat if the very rules that made you successful as a PCB designer are the ones now holding you back? This reminds me of walking the floor and attending sessions at both PCB West 2025 and APEX EXPO 2026, where one common theme stood out: More designs with traditional PCB “best practices” simply don’t apply. It’s not because they’re wrong, but because the problems we’re solving have fundamentally changed. In some cases, those best practices can actually limit performance. This is where PCB design moves beyond optimization and into something far more challenging: designing without a rulebook.
Custom LIDAR Optics Support Mission-Critical Performance
05/05/2026 | PRNewswireMeller Optics, Inc. has introduced custom fabricated LIDAR optics that can be engineered for specific UV to IR transmission requirements featured in airborne, ground, and maritime defense systems.
Trouble in Your Tank: In Complex Systems, Design Rules Aren’t Optional
05/06/2026 | Michael Carano -- Column: Trouble in Your TankThere is no question that the electronics industry, especially in circuit board design and fabrication, advanced packaging, and innovation throughout the value chain, has seen a significant transformation, whether it be in materials, system architecture, HDI and ultra HDI, semiconductors, or chiplets. AI and high-performance computing (HPC) are driving change across several fronts, including material properties, assembly techniques (think hybrid bonding), and power management.
EMI Strengthens Test Capability with Acculogic Flying Probe System
05/04/2026 | Express Manufacturing, Inc.Express Manufacturing, Inc. (EMI), a global electronics manufacturing services (EMS) provider, has added the Acculogic Scorpion 980E Flying Probe Test System to its inspection and test operations, giving the company greater flexibility in how it validates and supports today’s increasingly complex electronics.