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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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Relive the Experience: Real Time with… IPC APEX EXPO 2024 Show & Tell Magazine
May 16, 2024 | Real Time with...IPC APEX EXPOEstimated reading time: 1 minute
You came, you saw, and you experienced the magic of IPC APEX EXPO 2024. Now you get to relive the many memories and experiences in the pages of Real Time with… IPC APEX EXPO 2024 Show & Tell Magazine, our annual review of everything that happened during our week in Anaheim, California.
“A special thank you to the IPC team for organizing such a powerful event,” says Barry Matties, publisher of I-Connect007. The Technical Conference was world-class, and the well-thought-out Professional Development Courses are helping many to grow in their careers. The Emerging Engineer program is growing and helping our industry become better.”
What will you find inside this issue?
- Show reviews from industry professionals who traversed the show floor, attended conference sessions, and helped to connect all the pieces that this show offers.
- A view through a photographer's lens in our many photo galleries, capturing the show floor, keynote speakers, receptions, and of course, the guests.
- Nearly 100 video interviews with industry leaders who share topics of interest, including the latest innovations and product releases from their companies.
- Interviews with many of the recipients of IPC’s annual awards, including Hall of Fame, Dieter Bergman Fellowship Award, President’s Award, Rising Star, Best Technical Paper, Best Student Poster, and committee volunteers.
- Reviews of the three keynote speakers, winners of the IPC Design Competition, a review of Factory of the Future/CFX, and standards activity.
“In the end, it took many hands to make light work,” Matties says. “So, a big thank you to all who worked to make this show valuable to the industry and help us build electronics better.”
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Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
AI, Connectivity, and Systems-Level Thinking: New Frontiers in Advanced Packaging
04/16/2026 | I-Connect007 Editorial TeamThe upcoming issue of Advanced Electronics Packaging Digest examines key developments shaping the next phase of electronics innovation, from the reliability challenges of AI-driven packaging to emerging connectivity standards and the broader systems-level implications of artificial intelligence.
Webinar Review, Part 1: A Packaging Revolution Powering the Next Era of AI Compute
03/15/2026 | Marcy LaRont, I-Connect007The rapid rise of artificial intelligence has fundamentally reshaped the demands placed on semiconductor technology, and nowhere is it more evident than in advanced electronic packaging. A recent episode of the Global Electronics Association’s Executive Pulse webinar series, featuring Dr. Hemanth Dhavaleswarapu of AMD as the first of two esteemed presenters, provided a comprehensive overview of chip-level packaging. He outlined the evolution of AI workloads in forcing a rethinking of everything from chip architecture to data center design, with packaging now playing a central role in enabling continued performance scaling.
SMTA WLPS 2026 Review: Shifting Microelectronic Package Development
03/11/2026 | Vern Solberg, ConsultantThe Surface Mount Technology Association (SMTA) hosts a number of timely events each year to focus on key technologies. The most recent, the 2026 Wafer-Level Packaging Symposium, held in San Francisco this February, brought together prominent technologists and manufacturers involved in microelectronic package development and related infrastructure.
Changing the Electronics Systems Conversation
02/16/2026 | Nolan Johnson, SMT007 MagazineRebranding as the Global Electronics Association is not the only major change happening at APEX EXPO this year. There’s also a shift in the scope of the technical program as heterogenous integration and other advanced packaging methodologies come into the mainstream at both the component and system levels. We spoke with Matt Kelly, CTO and conference general chair, Devan Iyer, chief strategist for advanced electronic packaging, and Stan Rak and Udo Welzel, now in their fourth year as chairs of the Technical Program Committee, about what distinguishes the conference this year.
UHDI Fundamentals—Foundations and Drivers of the PCB Flex: Advanced Packaging Nexus, Part 1
03/02/2026 | Anaya Vardya, American Standard CircuitsThe electronics industry is undergoing a fundamental transformation driven by demands for smaller form factors, higher performance, and greater functional integration. Two technologies sit at the center of this transformation: flexible PCBs and advanced semiconductor packaging. In this article, I’ll explore the technical foundations and key forces driving this convergence. Flexible PCBs are electrical interconnects fabricated on bendable substrates such as polyimide or polyester. Unlike rigid PCBs, flex circuits can conform to three-dimensional shapes, enabling designers to route signals through space rather than across flat planes.