Trouble in Your Tank: Understanding Interconnect Defects, Part 1
It’s Only Common Sense: Marketing Isn’t Fluff, It’s Ammunition
Driving Innovation: Mechanical and Optical Processes During Rigid-flex Production
STARTEAM GLOBAL Acquires Italian PCB Factory, Expanding European Footprint
July 2, 2024 | STARTEAM GLOBALEstimated reading time: 2 minutes
STARTEAM GLOBAL, a premier manufacturer of Printed Circuit Board (PCB) technology and services, is excited to announce a significant strategic expansion with the acquisition of C.T.B Circuiti Stampati S.N.C. (C.T.B), a PCB manufacturing factory. Located in the scenic town of Flero (Brescia province) in northern Italy, the factory has been rebranded as Flero STARTEAM (FST) effective from June 5, 2024.
Introducing Flero STARTEAM (FST)
The acquisition strategically amplifies STARTEAM’s manufacturing policy and strengthens its market presence in Europe. Elevating the company's comprehensive service offerings, FST will concentrate on spearheading innovation through:
- Prototyping
- Sample Production
- Specialised High Mix Low Volume (HMLV) Manufacturing
- Quick Turn
- Customised Requirements
This expansion is a milestone for STARTEAM, reinforcing the company's presence in the heart of Europe and highlighting its dedication to serving its European customers in the most local and flexible way.
A Hub for Innovation & Service Excellence
FST is anticipated to transform into more than just a manufacturing facility; it will become a vibrant hub for collaboration and innovation. Equipped with the latest technology, the facility will host interactive customer workshops designed to merge STARTEAM’s technical expertise with the specific requirements of its customers, ensuring a smooth transition from prototype to full-scale production.
Milan's Neighbour: A Strategic Edge
Strategically situated approximately 90km east from Milan, the facility serves a convenient meeting point for business partners and customers. Operated by a team of dedicated experts, the plant is set to increase its capacity incrementally, aligning with customer demands. FST’s technology will initially focus on manufacturing 1–2 layer PCBs, including PTFE base material (Teflon) for high-frequency applications, with plans to expand capabilities up to 6 layers from Q4 2024 – Q1 2025.
Expert Leadership to Steer
FST is championed by a team of seasoned leaders, poised to steer the company toward future success. Uwe Schneider, a STARTEAM veteran and formerly Automotive Technical Director at the Jiangyou STARTEAM (JST) factory in China, has been appointed as General Manager at FST. Alongside him, Roberta Tonini, the former owner of C.T.B, will also take on the General Manager role.
Contributing to the strategic orchestration, Michael König, STARTEAM’s Chief Financial Officer, plays a pivotal role in the legal acquisition of the PCB factory.
With this leadership structure, FST is well-equipped to navigate ahead in the PCB industry.
FST’s Ambitious PCB Production Goals
The launch of the FST facility is indicative of STARTEAM GLOBAL's pursuit of operational excellence and service enhancement. This venture not only expands the company’s geographical footprint but also fortifies its operational capabilities, setting a new benchmark in meeting and exceeding the expectations of its global clientele.
Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Green Circuits Appoints Kaitlyn Muhlenforth as Marketing Manager
11/05/2025 | Green CircuitsGreen Circuits, a full-service Electronics Manufacturing Services (EMS) partner to leading OEMs, is excited to announce the appointment of Kaitlyn Muhlenforth as its new Marketing Manager.
On the Line With… Ultra HDI, Episode 8: “Materials, Up and Coming Capabilities,” Now Available
11/05/2025 | I-Connect007I-Connect007 is excited to announce the release of the eighth episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Materials, Up and Coming Capabilities,” host Nolan Johnson sits down with resident expert John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to discuss how material selection influences the Ultra HDI (UHDI) manufacturing process.
Target Condition: Distribution of Power—Denounce the Ounce
11/05/2025 | Kelly Dack -- Column: Target ConditionHave you ever wondered why the PCB design segment uses ounces to describe copper thickness? There’s a story behind all of this—a story that’s old, dusty, and more than a little absurd. (Note that I didn’t add “Like many of us.”) Legend has it that back in the days of copper tinkers and roofing tradesmen, the standard was set when a craftsman hammered out a sheet of copper until it weighed one ounce, when its area conveniently matched the square of the king’s foot.
Henger Microelectronics Expands Global Footprint with Major Equipment Shipment to Southeast Asia
10/31/2025 |Henger Microelectronics has reached a major milestone in its global expansion strategy with the successful shipment of advanced plasma etching and cleaning systems, along with automation equipment, to multiple countries and regions across Southeast Asia. This achievement marks a significant step forward in the company’s international growth and reinforces its position as a leading force in the global plasma equipment industry.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
10/31/2025 | Nolan Johnson, I-Connect007Last week, the IMPACT conference took place in Taipei, bringing together advanced packaging experts from around the globe to share their knowledge. We’ll be bringing you post-conference coverage over the next few weeks, so look for that in our newsletters, and in the Advanced Electronic Packaging Digest. Other news seemed to have the U.S. at the center of the global discussions. My picks start in Phoenix, where TSMC, NVIDIA, and Amkor are all scrambling to establish new capabilities. There’s nothing like a strong demand signal to cause build-out, and AI chips are doing exactly that.