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Ventec’s Value-Added Equipment Division Welcomes Marc Ladle as Project Manager
July 9, 2024 | VentecEstimated reading time: 1 minute
Ventec is pleased to announce the appointment of Marc Ladle to the position of Project Manager for Ventec Giga Solutions, its value-added PCB equipment division. Marc takes on his responsibility to assist customers with PCB manufacturing investment decisions by providing process design advice and technical input for equipment specifications. He will also manage and coordinate installation and commissioning at customer's premises. This latest addition to the Ventec Giga Solutions team demonstrates the company’s commitment to continue to considerably grow its value-added equipment business.
Marc started his professional career in precision engineering, moving into PCB manufacturing quality and production management roles at Eurotech in 1994. After joining APW in 1998 at their Southampton backplane facility, he helped rebuild the facility and replace equipment across the multilayer panel manufacturing line. His next step up the career ladder was his production manager appointment at Lyncolec where he oversaw the production of multilayer flex products amongst others. Since 2004, Marc has been responsible for project managing the installation of a variety of equipment, including AOI, Drilling and Routing, Electric Test, Drop on Demand Printing, Screen Printing, Photo Plotting, Plating lines (including VCP), and a significant number of Horizontal Process lines.
With over 37 years of focused PCB industry experience and an in-depth understanding of manufacturing processes and requirements, Marc brings considerable knowledge of working with suppliers and customers in over 30 countries across 5 continents. His excellent reputation and industry network has been built from consistent high-quality project management and delivery of client projects from specification through to equipment installation and commissioning of single equipment and entire industrial installations.
Ventec Giga Solutions provides comprehensive one-stop shop solutions to PCB and related industry customers globally, including factory design, equipment selection, sales, installation, and commissioning. The extensive equipment and consumables offering from Ventec Giga Solutions partners includes inkjet solutions (Hi-Print), laminator & laser application equipment (Leetech), vacuum filling & screen printing (Sunus), optical layup systems (Surge Robotic), cleaning machines & adhesive products (Yeitek), specialist lamination plates and pads (Cardel) and abrasives & non-woven products (Falkenrich).
"I am pleased to welcome Marc to our expanding equipment division team. His extensive industry knowledge and his specialist expertise for PCB manufacturing processes will further enhance our commitment to providing unrivalled process advice and technical support at the highest level to our growing global customer base”, said Ramesh Dhokia, Business Unit Director.
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Kevin Barrett Joins Technica USA as PCB Business Development and Account Manager
11/03/2025 | Technica USATechnica USA is proud to announce that Kevin Barrett has rejoined Team Technica as PCB Business Development /Account Manager.
Henger Microelectronics Expands Global Footprint with Major Equipment Shipment to Southeast Asia
10/31/2025 |Henger Microelectronics has reached a major milestone in its global expansion strategy with the successful shipment of advanced plasma etching and cleaning systems, along with automation equipment, to multiple countries and regions across Southeast Asia. This achievement marks a significant step forward in the company’s international growth and reinforces its position as a leading force in the global plasma equipment industry.
Hofstetter PCB Group Purchases Mass-PCB Vacuum-Filling & Planarising System from Adeon Technologies for New Via Filing Subcontract Services
10/30/2025 | ADEON TechnologiesDuring the Productronica Exhibition in Munich from November 18 through to 21, Adeon is announcing the sale of the newest 2025 model Via Filling equipment with Large Container System and the Planarising system from Mass-PCB to SMF-Hofstetter from Herrenberg, Germany.
ITW EAE to Showcase Latest Electronic Assembly Equipment Developments at productronica
10/21/2025 | ITWITW EAE will be showcasing its latest developments at productronica, November 18-21 in Munich, Germany. The ITW EAE booth A4–554 will have MPM, Camalot, Electrovert, Vitronics Soltec and Despatch applications experts on hand as well as sales and management to answer questions and offer solutions.
The Chemical Connection: Onshoring PCB Production—Daunting but Certainly Possible
10/22/2025 | Don Ball -- Column: The Chemical ConnectionIn the past year, several potential customers, concerned about the impending application of tariffs on incoming goods, have asked us what it would take to bring their circuit board production back to the U.S. While they also had other considerations, the threat of new tariffs was the tipping point that started them thinking about the economic advantages of bringing their manufacturing back onshore. It might be interesting to relate our experiences with two of those inquiries.