Northrop Grumman, Mitsubishi Electronic to Support Core Mission Capabilities in Japan
July 15, 2024 | Northrop GrummanEstimated reading time: Less than a minute
Northrop Grumman Corporation and Mitsubishi Electric Corporation (MELCO) signed a Memorandum of Understanding (MOU) to develop new opportunities for mission solutions in the United States and Japan.
Under this MOU, Northrop Grumman and MELCO will jointly pursue opportunities to deliver key capabilities, including electronic warfare, radar, power systems, connectivity, communications and processing, modeling and simulation, underwater sensors and uncrewed underwater vehicles. Both companies will collaborate on strategic industrial co-production opportunities and full lifecycle capabilities, including logistics and sustainment.
Experts:
Kenn Todorov, sector vice president, strategic growth, mission systems, Northrop Grumman: “Our agreement with Mitsubishi Electric Corporation expands our long-standing collaboration to promote Japanese industry and technology. By bringing our mission systems capabilities to a trusted partner who has been providing defense systems to the Japanese Ministry of Defense for over 50 years, we further our commitment to Japan and continued stability in the Indo-Pacific region.”
Masahiko Arai, corporate executive and senior general manager, defense systems, Mitsubishi Electric Corporation: "Through our collaboration with Northrop Grumman, we aim to maximize each other's strengths and create new value. By combining capabilities, we are confident that we can provide better products and services for our customers.”
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
India’s Aerospace and Defence Engineered for Power, Driven by Electronics
09/16/2025 | Gaurab Majumdar, Global Electronics AssociationWith a defence budget of $82.05 billion (2025–26) and a massive $223 billion earmarked for aerospace and defence spending over the next decade, India is rapidly positioning itself as a major player in the global defence and aerospace market.
VIDEOTON EAS's Bulgarian Subsidiary Expands Into Automotive Products
09/15/2025 | VideotonVEAS Bulgaria, engaged in electronics manufacturing, has joined the ranks of VIDEOTON companies authorized to produce automotive products.
Variosystems Strengthens North American Presence with Southlake Relaunch 2025
09/15/2025 | VariosystemsVariosystems celebrated the relaunch of its U.S. facility in Southlake, Texas. After months of redesign and reorganization, the opening marked more than just the return to a modernized production site—it was a moment to reconnect with our teams, partners, and the local community.
Hanwha Aerospace to Collaborate with BAE Systems on Advanced Anti-jamming GPS for Guided Missiles
09/15/2025 | HanwhaHanwha Aerospace has signed a contract with BAE Systems to integrate next-generation, anti-jamming Global Positioning System (GPS) technology into Hanwha Aerospace’s Deep Strike Capability precision-guided weapon system.
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).