David Schild Addresses Printed Circuit Board Issues as a Panelist at AUVSI

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Finetech Expands Volume Production Portfolio, Appoints André Thiemann Co-CEO

11/06/2026 | Finetech
Finetech, a supplier of high-precision die bonding systems for advanced packaging and heterogeneous integration, is expanding its management team: André Thiemann became Co-CEO on November 1.

Norautron, Fideltronik Join Forces

11/02/2026 | Norautron
Norautron AS has signed an agreement to acquire Fideltronik from Stardust Family Foundation who will become a significant shareholder in the combined group following the transaction.

SEMICON West 2026: Another Sold Out Show

10/21/2026 | Marcy LaRont, I-Connect007
It was a beautiful Fall Day in the heart of downtown San Francisco, as I headed off to the first official day of SEMICON West 2026 on October 13th. Luckily, the beautiful, sunny and crisp Fall weather would endure throughout the week, just as the state was also seeing unprecedented storm activity, flooding and damaging wave activity on the Southern California coast, that juxtaposition in what had once been the only real tech-forward state in the U.S. not lost on me.

Flex Announces CFO and Board Plans Following Separation

09/16/2026 | Flex
Flex announced that Amy B. Schwetz will join the company as Chief Financial Officer (CFO) of its Regulated Manufacturing Services (RMS) and Integrated Technology Services (ITS) segments on October 5, 2026, and is expected to serve as Flex CFO following completion of the planned separation of its Cloud and Power Infrastructure segment.

Scanfil to Expand its Myslowice Plant in Poland

09/10/2026 | Scanfil
Scanfil is expanding its Myslowice plant in Poland following strong new customer wins. The expansion will increase the production complex by 6,000 square meters, bringing the total area to roughly 36,000 square meters upon completion. It will become Scanfil’s largest factory in Europe by floor area.