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Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
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AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at NEPCON Vietnam
August 20, 2024 | AIMEstimated reading time: Less than a minute

AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming NEPCON Vietnam taking place September 11-13 at I.C.E. Hanoi, Vietnam. Among other great products, AIM will be highlighting its recently released NC259FPA Ultrafine No Clean Solder Paste.
NC259FPA is a zero-halogen paste engineered for precise print definition with type 6 and smaller alloy powders through stencil apertures less than 150 µm in diameter. Ideal for miniLED, microLED, die attach, micro BGA, and HDI boards, this innovative new product features excellent wetting, high transfer efficiency, high reliability, and high tack force for mass transfer.
To learn more about NC259FPA and to discover all of AIM’s products and services, visit the company at NEPCON Vietnam September 11-13th at booth U05.
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Indium to Feature Precision Gold-Based Die-Attach Preforms at IMS 2025
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Altus Supports Phoenix Systems in Advancing THT Assembly with Robotic Soldering
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Advancements in High-reliability Alloys for Automotive and High-performance Applications
05/22/2025 | Barry Matties, I-Connect007At IPC APEX EXPO, MacDermid Alpha Electronic Solutions showcased its latest innovations in SMT assembly materials designed to meet the growing demands for reliability and sustainability in automotive and high-performance applications. In this interview, Ebad Rehman, business product manager, discusses the evolution of high-reliability alloys, spotlighting ALPHA Innolot, a proven solution developed in response to the automotive industry’s increasing expectations for durability and performance under harsh operating conditions.