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Biden-Harris Administration Announces Arizona State University Research Park as Planned Site for Third CHIPS for America R&D Flagship Facility

01/08/2025 | U.S. Department of Commerce
The Department of Commerce and Natcast announced the Arizona State University (ASU) Research Park in Tempe, Arizona as the anticipated location for the third flagship CHIPS for America research and development (R&D) facility.

SMTA Announces Wafer-Level Packaging Symposium Program

01/08/2025 | SMTA
The SMTA is excited to announce the technical program for the 2025 Wafer-Level Packaging Symposium. The symposium will be held February 18-20, 2025 at The Hyatt Regency San Francisco Airport in San Francisco, California.

SIA Welcomes Announcement of New CHIPS for America R&D Facility in Arizona for Semiconductor Prototyping and Advanced Packaging

01/07/2025 | SIA
The Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer commending the announcement of a new CHIPS for America research and development (R&D) facility in Arizona for semiconductor prototyping and advanced packaging.

SCHMID Group Reports H1 2024 Financial Results and Guidance Update

01/03/2025 | SCHMID Group
SCHMID Group N.V., a global leader in providing solutions to the high-tech electronics, photovoltaics, glass, and energy systems industries, reports its unaudited financial results for the first half of 2024, covering the period ended June 30, 2024 and updates its full-year 2024 guidance.

$100M Investment Will Propel Absolics, Georgia Tech’s Advanced Packaging Research

12/30/2024 | Georgia Tech
As part of the CHIPS National Advanced Packaging Manufacturing Program (NAPMP), three advanced packaging research projects will receive investments of up to $100 million each.
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