Semtech Accelerates 5G-Advanced Infrastructure Buildouts
September 23, 2024 | BUSINESS WIREEstimated reading time: 1 minute
Semtech Corporation, a high-performance semiconductor, IoT systems, and cloud connectivity service provider, today announced sampling of GN2255S, its next generation Tri-Edge 50 Gbps clock and data recovery (CDR) with integrated DML driver for SFP56 50G PAM4 bidirectional (BiDi) and CWDM6 optical modules. As part of the industry’s only analog solutions for 50 Gbps fronthaul, the new CDR can lead to simpler, potentially more power-efficient designs. Its real-time signal processing delivers ultra-low latency crucial for 5G Advanced time-critical services, such as required in public safety, industrial control, smart grid management, and more.
According to the latest Ericsson Mobility Report, 5G subscriptions will more than double from 2024 to 2029, with mobile data traffic forecast to exceed 230 exabytes monthly by 2029. Exponential data demands, along with use cases like generative AI, machine learning (ML), and augmented reality (AR), will drive infrastructure upgrades. With its faster data transfer and improved connectivity, integration of 5G advanced technology will further boost network performance, intelligence, and sustainability.
“As a Mobile Optical Pluggable Alliance (MOPA) founding member, Semtech works closely with the world’s telecom leaders and mobile operators to develop the right optical solutions that solve industry challenges,” said Raza Khan, product marketing director for Semtech’s Signal Integrity Products Group and chief marketing officer of MOPA. “Our Tri-Edge solutions for bidirectional and CWDM optical pluggables are a direct result of these collaborations. Enabling the next round of infrastructure upgrades over single fiber will give carriers greater cost-effectiveness, flexibility and scalability to advance global mobile networks.”
“Optical pluggable innovations like Semtech’s move the industry towards the high performance and latency needed for global mobile networks to become the digital backbone of society and industry 4.0,” said Stefan Dahlfort, chairman and president of the board of MOPA.
Semtech at ECOC 2024
Semtech’s demos in booth E37, MR21, MR22 will showcase solutions for datacenter, wireless, and PON. Meetings are by appointment only.
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Federal Electronics Mexico Boosts Speed and Flexibility with New Mycronic A40DX Pick-and-Place
07/23/2025 | Federal ElectronicsFederal Electronics, a leader in providing advanced electronic manufacturing services, has announced a major upgrade at its Hermosillo, Mexico facility with the installation of a Mycronic MYPro A40DX Pick-and-Place system, advancing its surface mount assembly capabilities for high-reliability electronics manufacturing.
DuPont Publishes 2025 Sustainability Report
07/22/2025 | PRNewswireDuPont published its 2025 Sustainability Report detailing the progress made toward achieving its 2030 Sustainability Goals.
NEOTech’s Westborough Facility Achieves AS9100 Surveillance Audit, Reinforcing Trust with Aerospace & Defense Customers
07/22/2025 | NEOTechNEOTech, a premier provider of electronic manufacturing services (EMS), integrated design engineering, and advanced supply chain solutions for the aerospace and defense, medical device, and high-tech industrial markets, proudly announces that its Westborough, Massachusetts facility has successfully completed the rigorous AS9100 Bi-Annual Surveillance Audit with zero findings, a testament to the company’s unwavering commitment to quality, security, and operational excellence.
PCBAA Wins Summit Silver Award from the American Society of Association Executives
07/18/2025 | PCBAAPCBAA was one of 38 associations that earned Silver Awards for outstanding contributions for an entry titled: Chips Don’t Float: More Printed Circuit Boards Must be Made in America.
INSPECTIS AB ‘Makes it a Meal’ with Series U50s Advanced Kit
07/18/2025 | INSPECTIS ABFamous chefs the world over maintain that an entrée doesn’t make a great meal without side dishes. At INSPECTIS, we call those ‘sides’ an Advanced Kit.