Global Sourcing Spotlight: Tariffs—The New Reality
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
Punching Out: Your Financial Preparation for a Sale
Automating Test Processes in Modern PCBA Manufacturing
November 12, 2024 | Josh Casper, Horizon SalesEstimated reading time: 1 minute
ICT and functional test play critical roles in the electronics manufacturing process. In many cases, these processes are the final line of defense in identifying defects, preventing failures from reaching the end user, and safeguarding a manufacturer's reputation.
A growing problem in this area has been the sheer increase in production output from the SMT line. As components get smaller, PCBs will continue shrinking, allowing engineers to design highly panelized products. SMT processes such as printing, placement, and 3D inspection have kept pace with these developments, while traditional testing methods have not scaled to the same degree. The growing mismatch between SMT line speeds and offline test cells has led to higher costs, increased scrap, and significant operational inefficiencies, especially in these highly panelized products.
How do we solve this problem? Automation of course. Over the years, developments in ICT and functional test technology have significantly closed the gap between SMT production and the test process, leading to major shifts in how this process is approached. I’ll explore the unique challenges associated with the test area, and the key benefits to investing in an automated approach.
Continue reading this article in the November 2024 issue of SMT007 Magazine.
Share on:
Suggested Items
The Test Connection Inc. Appoints USM Reps as Exclusive Sales Representative in Mexico
05/13/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a leading provider of electronic test and manufacturing solutions, is pleased to announce the appointment of USM Reps as its exclusive sales representative in Mexico.
Top 10 OSAT Companies of 2024 Revealed—China Players See Double-Digit Growth, Reshaping the Global Market Landscape
05/13/2025 | TrendForceTrendForce’s latest report on the semiconductor packaging and testing (OSAT) sector reveals that the global OSAT industry in 2024 faced dual challenges from accelerating technological advancements and ongoing industry consolidation.
Innovative Technology Advancements in Test: HATS² Technology and Its Impact on Reliability Testing
05/14/2025 | Barry Matties, I-Connect007Ensuring the reliability of printed circuit boards (PCBs) has become increasingly difficult and critical, yet the development of advanced testing methodologies is essential to meeting industry demands and addressing persistent challenges. One significant innovation is the High Acceleration Thermal Shock (HATS²) test system, which transforms how reliability testing is conducted. After 40 years in the testing business at Microtek, Bob Neves is beginning a new journey with his company, Reliability Assessment Solutions Inc. (RAS).
Discover TRI Test Solutions at New-Tech 2025
05/08/2025 | TRIBynet Testing Systems, TRI's industry partner, will join New-Tech 2025 at EXPO Tel-Aviv, Pavilion 1 from May 20 – 21, 2025.
Datest Expands Presence in the Upper Midwest with Omni-Tec Partnership
05/05/2025 | DatestDatest, a trusted leader in advanced testing, engineering, inspection, and failure analysis services, is proud to announce its partnership with Gary Krieg of Omni-Tec, Inc. as its official sales representative in the Upper Midwest.