Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

YINCAE: UF 158UL Redefines Underfill for Large Chips

03/12/2025 | YINCAE
YINCAE, a leading innovator in advanced materials solutions, today announced the launch of its groundbreaking underfill material, UF 158UL. This cutting-edge product is designed to meet the increasing demands of large format chips, offering unparalleled performance in room temperature flow, fast cure, and high reliability.

The Test Connection Inc. Promotes Melanie Rutkauskas to Director of Operations for The Training Connection, LLC

03/11/2025 | The Test Connection Inc.
The Test Connection Inc. (TTCI), a leading provider of electronic test and manufacturing solutions, is pleased to announce the promotion of Melanie Rutkauskas to Director of Operations for The Training Connection, LLC (TTC-LLC). With her extensive background in operations management, accounting, and customer relations, Melanie brings a wealth of experience and leadership to her new role.

Apple’s Year-End Production Peak and China’s Subsidy Policies Drive 9.2% QoQ Growth in 4Q24 Smartphone Production

03/11/2025 | TrendForce
TrendForce reports that global smartphone production in the last quarter of 2024 reached 334.5 million units, reflecting a 9.2% QoQ increase, driven by Apple’s peak production season and consumer subsidies from local Chinese governments.

Indium Corporation, Industry Partners to Showcase Products 'Live@APEX'

03/10/2025 | Indium Corporation
Indium Corporation®, in cooperation with its industry partners, will feature its proven solder solutions live on the show floor throughout IPC APEX Expo from March 18-20 in Anaheim, California.

IPC Global Standards Driving Factory of the Future

03/10/2025 | Chris Jorgensen, IPC
Factory of the Future represents a revolutionary shift in electronics manufacturing, aligning the industry's processes with the demands of efficiency, innovation, and sustainability. With challenges such as rapid product lifecycles, stringent quality requirements, and increasing emphasis on environmental responsibility, stakeholders across the supply chain—OEMs, EMS providers, and PCB manufacturers—face mounting pressure to modernize their operations.
Copyright © 2025 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in