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Current IssueAdvancing the Advanced Materials Discussion
Moore’s Law is no more, and the advanced material solutions to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
Inventing the Future With SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
Sales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
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Real Time with... electronica 2024: ICAPE—Localized Manufacturing Strategies and Strategic Acquisitions
November 26, 2024 | Real Time with... electronicaEstimated reading time: Less than a minute
Pete Starkey interviews Christelle Bonnevie, chief industrial officer at ICAPE Group. Bonnevie summarizes the evolution of the group and the strategy of developing a network of manufacturing facilities outside Asia. She also discusses the recent acquisition of NTW in Japan and explains the mechanism of integrating it into the ICAPE organization. Click here to listen.
For more coverage from electronica 2024 or to visit our event photo gallery, click here.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Amplifying Innovation: New Podcast Series Spotlights Electronics Industry Leaders
10/08/2025 | I-Connect007In the debut episode, “Building Reliability: KOKI’s Approach to Solder Joint Challenges,” host Marcy LaRont speaks with Shantanu Joshi, Head of Customer Solutions and Operational Excellence at KOKI Solder America. They explore how advanced materials, such as crack-free fluxes and zero-flux-residue solder pastes, are addressing issues like voiding, heat dissipation, and solder joint reliability in demanding applications, where failure can result in costly repairs or even catastrophic loss.
Hall of Fame Spotlight Series: Highlighting Dan Feinberg
10/08/2025 | Gene WeinerThis Hall of Fame spotlight features Dan Feinberg. Dan and I have been friends in a variety of relationships and activities for more than half a century. His journey in the electronics and the PCB industry is a testament to dedication, innovation, and leadership. His contributions span over five decades, introducing new technologies, mentoring professionals, and advocating for policies that strengthened manufacturing in the United States. As a Hall of Fame member, Dan’s legacy continues to inspire new generations of engineers, technologists, and business leaders.
BAE Systems-built Carruthers Geocorona Observatory and SWFO-L1 Spacecraft Successfully Launch
09/29/2025 | BAE SystemsBAE Systems is celebrating the successful launch of two spacecraft from Kennedy Space Center in Florida, supporting vital NASA and National Oceanic and Atmospheric Administration (NOAA) space weather missions.
It’s Only Common Sense: Pricing PCBs? It’s All in Their Heads
09/29/2025 | Dan Beaulieu -- Column: It's Only Common SenseLet’s talk about pricing—not the math, the spreadsheets, or the cost-plus formula your finance guy loves—but the actual game: perception. If you’re trying to win jobs by being the lowest bidder, you’re not competing; you’re commoditizing yourself. Once you do that, good luck climbing back up the value ladder. You’re no longer a partner; you’re a line item on a spreadsheet.
How PCBA Excellence Transforms High-mix Operations
09/22/2025 | Chintan Sanghani, Electronics Center for ExcellenceWith over 30 years of manufacturing excellence, our organization has built deep expertise in PCBA contract manufacturing for downhole oilfield tools. Through years of focused operational leadership in this demanding sector, we've learned that in high-mix, low-volume (HMLV) environments, traditional manufacturing approaches can create more bottlenecks than breakthroughs.