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In this issue, we examine the critical nature of building precisions into your inner layers and assessing their pass/fail status as early as possible. Whether it’s using automation to cut down on handling issues, identifying defects earlier, or replacing an old line...
Engineering Economics
The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
Alternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
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Real Time with... electronica 2024: ICAPE—Localized Manufacturing Strategies and Strategic Acquisitions
November 26, 2024 | Real Time with... electronicaEstimated reading time: Less than a minute
Pete Starkey interviews Christelle Bonnevie, chief industrial officer at ICAPE Group. Bonnevie summarizes the evolution of the group and the strategy of developing a network of manufacturing facilities outside Asia. She also discusses the recent acquisition of NTW in Japan and explains the mechanism of integrating it into the ICAPE organization. Click here to listen.
For more coverage from electronica 2024 or to visit our event photo gallery, click here.
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MicroCare Welcomes Greg Gascon as Strategic Account Executive
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Solar Powered Aircraft Achieves New Stratospheric Success
12/26/2024 | BAE SystemsA British-led team of engineers has taken a leap forward in the race to harness the stratosphere for earth observation and communications, completing a new series of test flights of BAE Systems’ High Altitude Pseudo Satellite (HAPS) Uncrewed Aerial System (UAS), PHASA-35®, in quick succession.
The Effects of Copper on a Transmission Line
12/23/2024 | Todd Kolmodin, Gardien ServicesAs technology advances, our substrates become increasingly smaller, and chip technology has progressed to where HDI and UHDI are household terms. Ten years ago, this new design architecture would strike fear in the hearts of any plating engineer. Unfortunately, North American and European manufacturing has lagged due to excessive offshoring of commercial and some high-reliability product lines. Fortunately, most of the military and aerospace product has remained controlled. But in doing so, the designs utilized by the mil/aero and medical sectors’ reliability lines were corralled into the manufacturing capabilities of the North American and European providers.
OKI Develops PCB Technology with Stepped Copper Coin Insertion to Achieve 55 Times Better Heat Dissipation in Outer Space
12/12/2024 | BUSINESS WIREThe OKI Group printed circuit board (PCB) business company OKI Circuit Technology has successfully developed multilayer PCB technology with stepped copper coin insertion to achieve 55 times better heat dissipation compared to conventional PCB. The stepped copper coin is offered in two types, circular and rectangular, to suit the shape of the electronic component mounted on the PCB. OTC is working to develop mass-production technologies with the aim of introducing PCBs incorporating this new technology into markets for compact devices or devices used in outer space or other environments where air cooling technology cannot be used.
NASA Eyes Launching SPHEREx Sky-Mapping Mission in Early 2025
12/11/2024 | NASANASA and SpaceX are targeting late February 2025 for the launch of the agency’s next astrophysics observatory, SPHEREx. Short for Spectro-Photometer for the History of the Universe, Epoch of Reionization and Ices Explorer, SPHEREx will launch aboard a SpaceX Falcon 9 rocket from Vandenberg Space Force Base in California. The observatory will lend insight into what happened after the big bang, measure the glow of galaxies near and far, and search the Milky way for building blocks of life.