Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"

Rachael Temple - Alltemated

Suggested Items

Elephantech's SustainaCircuits FPC Adopted for Mass Production in OM Digital Solutions’ Interchangeable Lens

10/06/2025 | Elephantech
Elephantech Inc. is pleased to announce that its proprietary flexible printed circuits (FPCs) have been adopted for mass production by OM Digital Solutions Corporation in the company’s latest flagship products.

TT Electronics Secures Multi-Million-Pound Defense Contract with Ultra PCS

07/18/2025 | TT Electronics
TT Electronics, a leading provider of global manufacturing solutions and engineered technologies, announced that it has been awarded a significant new contract with long-standing customer Ultra PCS Ltd (Ultra Precision Control Systems).

Gartner Says Worldwide PC Shipments Increased 4.4% in Second Quarter of 2025

07/14/2025 | Gartner, Inc.
Worldwide PC shipments totaled more than 63 million units in the second quarter of 2025, a 4.4% increase from the second quarter of 2024, according to preliminary results by Gartner, Inc.

PC Shipments Remained Strong in Q2 Signaling Vendors Getting Ahead of Tariff Deadlines

07/09/2025 | IDC
PC shipments during the second quarter of 2025 grew 6.5% from the prior year, with global volumes reaching 68.4 million shipments, according to preliminary results from the International Data Corporation (IDC) Worldwide Quarterly Personal Computing Device Tracker.

The Government Circuit: From Tax Policy to Tariffs, Denver to Delhi, Speaking Up for Electronics 

06/18/2025 | Chris Mitchell -- Column: The Government Circuit
I had the privilege of attending the June 3 opening ceremony of AT&S’s HTB3 facility in Leoben, Austria—a milestone moment for Europe’s electronics ecosystem. HTB3 is now the first and only facility in Europe capable of both developing and producing high-performance IC substrates—the advanced platforms that allow powerful chips to connect, process, and function. As demand for AI, 5G, and other cutting-edge technologies grows, so too does the need for sophisticated substrates like those HTB3 will produce.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in