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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
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Laser Photonics Advances PCB Marking Technology R&D for Electronics and Semiconductor Manufacturing
December 13, 2024 | Laser PhotonicsEstimated reading time: 1 minute
Laser Photonics Corporation, a leading global developer of industrial laser systems for cleaning and other material processing applications, and its recently acquired subsidiary, Control Micro Systems, Inc.(CMS), announced the expansion of their Printed Circuit Board (PCB) Marking technology development program targeting the semiconductor and electronics market.
Laser marking is vital in semiconductor production, a market projected to reach $1 trillion annually by 2030. High-speed laser processing equipment is essential to meet the demand for advanced chips. CMS, with decades of experience, develops automated PCB Marking technology that provides a high-speed process for etching serial numbers, barcodes, logos, and other tracking data with precision and efficiency. These systems can be configured for standalone operation or integrated into existing SMT lines.
“Combining CMS’s expertise with our R&D initiatives allows us to further develop its cutting-edge PCB Marking Technology to meet the semiconductor sector’s stringent demands,” said Wayne Tupuola, CEO of LPC. “We are excited to continue pushing the boundaries of what is possible with laser technology as we work toward setting new industry standards.”
The current PCB Marking systems built by CMS are Class I systems that can effectively mark onto all types of PCB, including FR-4, CEM-1, phenolic paper, ceramic substrates, and solder mask substrates. These laser marking systems use off-axis machine vision to detect fiducials, determine processing locations, and verify marked data. CMS Laser is a certified Cognex integrator, leveraging expertise with advanced camera systems.
For LPC, established as a trusted provider of industrial laser equipment, semiconductor technologies are a new sector of focus. Supplemented by CMS expertise, LPC is dedicating resources to research and development in this sector in accordance with its broad diversification strategy, poised to contribute to growing shareholder value and foster greater resilience in evolving markets.
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IEEE Study Describes Breakthroughs in Semiconductor Nanolasers for Ultra-Efficient Optical Technologies
06/25/2025 | PRNewswireA new wave of innovation is transforming the future of optical technologies, driven by rapid advancements in semiconductor nanolasers. These advances are essential for future applications such as on-chip optical communication and neuromorphic computing, which require compact, energy-efficient light sources.
Excellon Installs COBRA Hybrid Laser at Innovative Circuits
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The Chemical Connection: Through-glass Vias in Glass Substrates
06/24/2025 | Don Ball -- Column: The Chemical ConnectionThis month’s theme is vias and how best to ensure via quality and reliability. I don’t have much expertise in this process area or much to contribute that most of you don’t already know. However, I’ve recently become peripherally involved in a via technology that may be of more than academic interest to some of us. It entails putting vias in a material not usually associated with PCB manufacturing: through-glass vias (TGVs) in glass substrates.
The Evolution of Picosecond Laser Drilling
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Altus, Danutek Expand Partnership with LPKF to Offer Laser Plastic Welding Solutions
05/21/2025 | Altus GroupAltus Group, a leading supplier of capital equipment and service support for the electronics manufacturing sector in the UK and Ireland, and its sister company Danutek, which serves Central and Eastern Europe, are expanding their technology offering through an enhanced partnership with LPKF, a specialist in laser-based manufacturing solutions.