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We take a hard look at fueling the workforce pipeline, specifically at the early introduction of manufacturing concepts and business to young people in this issue of PCB007 Magazine.
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Zhen Ding Kaohsiung AI Park Obtained the Investment Approval by the Southern Taiwan Science Park Bureau
December 30, 2024 | Zhen Ding TechnologyEstimated reading time: Less than a minute
Zhen Ding Technology Holding Limited, a global leading PCB manufacturer, reported, obtained the investment application of its subsidiary in Kaohsiung Al Park approved by the Southern Taiwan Science Park Bureau.
It is estimated that the future investment amount is NT$2 billion. In addition to the research and development and production of high-layer counts RPCB and high-density Interconnects boards (HLC-HDI) for Al server needs, in order to cooperate with important customers to develop the technology required for the next generation of high-end hardboard products, a hardboard research and development center will be built simultaneously in the STSP branch to establish relevant technical capabilities early, and through cooperation with important customers, it will cultivate printed circuit board technical talents with an international view to respond to the era of rapid competition in the future.
Suggested Items
Bridging Career Pathways in Electronics
01/27/2025 | Marcy LaRont, I-Connect007Dr. Lisa Burns is the career and technical education (CTE) coordinator at Fremont Unified School District in California, where several middle and high schools are participating in Project Lead the Way, a specialized curriculum involving partnerships among schools, industry, and higher education. Having a career in tech before moving into education, Lisa has maintained that passion as she now works with industry partners to integrate educational curriculum with hands-on projects, mentorships, and internships.
Infineon and the BSI Pave the Way for Quantum-Resilient Future
01/27/2025 | InfineonInfineon Technologies AG has achieved a milestone on the way to a quantum-resilient world in collaboration with the German Federal Office for Information Security (BSI). I
TRUMPF, SCHMID Group Enable Cost-effective High-speed Chips
01/24/2025 | SCHMID GroupTRUMPF and the SCHMID Group are developing an innovative manufacturing process for the latest microchip generation for the global chip industry.
I-Connect007 Editor's Choice: Five Must-Reads for the Week
01/24/2025 | Andy Shaughnessy, Design007This week’s round-up includes a variety of valuable articles, columns, and news items, focusing on the future of the industry, global markets, and more. Don’t forget to peruse our latest book, The Printed Circuit Designer’s Guide to... More Secrets of High-Speed PCBs, by Martyn Gaudion of Polar Instruments. I hope to see you at DesignCon!
L3Harris Showcases Robotic Drone Detection Capability for US Army
01/21/2025 | L3Harris TechnologiesL3Harris Technologies has successfully demonstrated a new drone detection and defeat capability for its T7 robot system at Vanguard 24, an annual capstone experiment the U.S. Army hosts at Fort Huachuca, Arizona..