SMT Perspectives & Prospects: Artificial Intelligence Part 6: Data Module 1
Standard of Excellence: Overcoming Service Failures—The Art of the Apology
Nolan’s Notes: Tariffs, Technologies, and Optimization
SMTA Hosts Ultra High Density Interconnect Symposium
December 31, 2024 | SMTAEstimated reading time: Less than a minute
The Surface Mount Technology Association (SMTA) is pleased to announce the Ultra High Density Interconnect (UHDI) Symposium, taking place on Thursday, January 23 2025, at the Peoria Sports Complex in Peoria, Arizona.
Designed for industry leaders, researchers, engineers, designers, and academics, the UHDI Symposium fosters collaboration and knowledge sharing on the latest advancements and challenges in Ultra HDI technology.
Key Topics:
- PCB Design for Ultra HDI
- Fabrication Techniques for Ultra HDI
- Assembly Considerations for Ultra HDI
- Reliability Testing and Qualification for Ultra HDI
As the semiconductor industry pushes the boundaries of miniaturization and performance, the UHDI Symposium provides a platform to explore:
- Emerging trends and innovations in Ultra HDI technology
- Strategies for overcoming design, fabrication, assembly, and reliability challenges
- Accelerating the transition from prototype to high-mix, low-volume manufacturing
- Don't miss this opportunity to connect with industry experts, gain valuable insights, and shape the future of Ultra HDI technology.
For more information, visit https://smta.org/mpage/uhdi/.
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
I-Connect007 Releases Episode 5 of Groundbreaking Ultra HDI Podcast Series
10/10/2025 | I-Connect007In Episode 5 “Via Structures,” host Nolan Johnson welcomes back John Johnson, Director of Quality and Advanced Technology at American Standard Circuits. Together, they explore the designer’s perspective on UHDI’s impact on via structures, diving into the metallurgy, chemistry, mechanical considerations, and stackup reduction that provide greater design flexibility and fewer constraints than ever before.
How Does UHDI Improve Routing Capabilities? Listen to Episode 3 Now and Discover
09/29/2025 | I-Connect007Episode 3 of On the Line With... American Standard Circuits, “How Does Ultra HDI Benefit: Routing Capabilities,” features host Nolan Johnson in conversation with returning guest expert John Johnson, Director of Quality and Advanced Technology at American Standard Circuits (ASC). Together, they explore how UHDI technology is transforming design for manufacturability and expanding what’s possible in routing capabilities.
TTM Technologies Expands Ultra Small Radio Frequency Components Offering for Telecom, Test and Measurement, and COTS Mil-Aero Applications
09/22/2025 | Globe NewswireTTM Technologies, Inc continues to innovate in the field of Radio Frequency & Specialty (RF&S) components with the introduction of new ultra small RF crossover and splitter components. Building on TTM’s commitment to meet the evolving demands within the Telecom, Test and Measurement, and Commercial Off-the-Shelf (COTS) Mil-Aero sectors, these latest offerings further enhance our product lineup.
On the Line With… Podcast: UHDI and RF Performance
09/22/2025 | I-Connect007I-Connect007 is excited to announce the release of a new episode in its latest On the Line with... podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra High Density Interconnect (UHDI).
ROHM Develops Ultra-Compact CMOS Op Amp: Delivering Industry-Leading Ultra-Low Circuit Current
09/11/2025 | ROHMROHM’s ultra-compact CMOS Operational Amplifier (op amp) TLR1901GXZ achieves the industry’s lowest operating circuit current.