Nolan’s Notes: The Interconnectedness of a Global Supply Chain
SMT Perspectives and Prospects: Warren Buffett’s Perpetual Wisdom, Part 1
Standard of Excellence: Training Your Team to Excel in Customer Service
SMTA Announces Wafer-Level Packaging Symposium Program
January 8, 2025 | SMTAEstimated reading time: 1 minute
The SMTA is excited to announce the technical program for the 2025 Wafer-Level Packaging Symposium. The symposium will be held February 18-20, 2025 at The Hyatt Regency San Francisco Airport in San Francisco, California.
The technical program features a special keynote presentation. On Wednesday, February 19, 2025, Eric Breckenfeld, Nvidia, and Erik Hadland, Semiconductor Industry Association, will co-present, “The CHIPS and Science Act: Past, Present and Future of U.S. Microelectronics R&D.”
Technical sessions include over 20 expert speakers who delve into wafer-level packaging advances, assembly/integration process, novel interconnect & packaging process and materials, substrate/integration platform, test & metrology, fan-out wafer-level packaging, and more. The program features presentations from leading companies including adeia, Nvidia, NHanced Semiconductors, Semiconductor Industry Association, and universities such as Hanyang University, Yokohama National University, and more.
The symposium kicks off with two professional development courses on Tuesday, February 18, 2025. The first course, “Materials for Semiconductor Packaging,” will be instructed by Terry Alford, Arizona State University. Gamal Refai Ahmed, Ph.D., AMD, will instruct the second course, “Current & Future Challenges and Solutions in AI & HPC System & Thermal Management.” Access to these courses is included in standard registration.
Registration for this event is open. Click here to register. Discounted rates are available by registering on or before January 27, 2025. All presentations, professional development courses and events open to attendees are included in registration.
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
ViTrox Unveils Smart 3D AOI Solutions, Pioneering Dual-Sided Inspection and Robotic Vision Solutions for Back-end Assembly Processes
08/04/2025 | ViTroxViTrox, which strives to be the World’s Most Trusted Technology Company, proudly announces the launch of its new-generation innovations in Automated Optical Inspection (AOI) technology for back-end assembly processes.
Transition Automation to Debut Sliding Paste Retainers at SMTA International
08/04/2025 | Transition Automation (TA)Transition Automation, Inc. (TA) will exhibit a new Paste Retainer option in booth 2947 at the SMTA International 2025, taking place from Oct. 21-23, 2025, at the Donald E. Stephens Convention Center in Rosemont, IL.
August 2025 SMT007 Magazine: Supply Chain Strategies
08/04/2025 | I-Connect007 Editorial TeamBelieve it or not, how you manage your supply chain has a noticeable impact on how your brand is perceived. In this issue of SMT007 Magazine, we explore the connection between supply chain practices and brand perception—and what you can do to strengthen it.
Indium Corporation Introduces New Flip-Chip Flux for Semiconductor Devices
07/31/2025 | Indium CorporationIndium Corporation, a leading materials refiner, smelter, manufacturer, and supplier, today announced the global availability of WS-910 Flip-Chip Flux, a new water-soluble flip-chip dipping flux designed to meet the demands of cutting-edge semiconductor devices.
FlashPCB Enhances SMT Production Line with Heller 1809 Reflow Oven and KIC ProBot
07/31/2025 | FlashPCBFlashPCB, a leading provider of quick-turn PCB assembly, has expanded its surface mount production capabilities with the installation of a Heller 1809 MKII reflow oven paired with the KIC ProBot automatic profiling system. This addition supports FlashPCB’s goal of achieving faster throughput, higher quality assurance, and consistent process control across a wide range of PCB builds.