U.S. Department of Commerce Announces Preliminary Terms with MACOM to Help Strengthen Supply Chain Resilience for U.S. Defense and Telecommunications Industries
January 16, 2025 | U.S. Department of CommerceEstimated reading time: 2 minutes
The U.S. Department of Commerce signed a non-binding preliminary memorandum of terms (PMT) with MACOM Technology Solutions Inc. (MACOM) to provide up to $70 million in proposed direct funding under the CHIPS and Science Act. The proposed CHIPS funding would support the expansion and modernization of MACOM’s facilities in Lowell, Massachusetts, and Durham, North Carolina, and would create up to 350 manufacturing jobs and nearly 60 construction jobs across both states.
“Today’s announcement with MACOM is another example of how CHIPS for America is making targeted and strategic proposed investments across the semiconductor industry,” said U.S. Secretary of Commerce Gina Raimondo. “As a result of the bipartisan CHIPS and Science Act, we are strengthening U.S. supply chain security and advancing our technological leadership of the 21st century.”
Both of MACOM’s facilities that would be supported by the proposed CHIPS investment are Category 1A Trusted Foundries with the U.S. Department of Defense (DoD) and produce compound semiconductors that are important to the proper functioning of defense systems operating at high frequencies, including airborne and ground-based radar systems, as well as commercial applications such as telecommunications. The proposed projects would increase production of existing 100mm Gallium Nitride (GaN) and Gallium Arsenide (GaAs) semiconductor fabrication and introduce production of 150mm GaN. The added manufacturing capacity supported by this proposed investment would also help support that future DoD and industrial base demand for Radio Frequency (RF) and microwave GaN technology can be satisfied domestically.
“Today’s announcement showcases how the CHIPS and Science Act is enabling the United States to develop the most advanced technologies while protecting our national security and bringing economic opportunity to communities throughout the country,” said National Economic Advisory Lael Brainard.
MACOM provides company wide training, professional development, internship opportunities, and tuition reimbursement to support employee career growth and advancement. MACOM also collaborates with leading technical universities and colleges across the United States on semiconductor research projects to develop its future workforce. The proposed CHIPS funding would allow MACOM to further expand these workforce development programs across manufacturing and other technical positions.
MACOM has indicated that it plans to claim the Department of the Treasury’s Advanced Manufacturing Investment Credit (CHIPS ITC), which is 25% of qualified capital expenditures. Click here to learn more about the tax credit.
As explained in its first Notice of Funding Opportunity, the Department of Commerce may offer applicants a PMT on a non-binding basis after satisfactory completion of the merit review of a full application. The PMT outlines key terms for a potential CHIPS incentives award, including the amount and form of the award. The award amounts are subject to due diligence and negotiation of award documents and are conditional on the achievement of certain milestones. After a PMT is signed, the Department of Commerce begins a comprehensive due diligence process on the proposed projects and continues negotiating or refining certain terms with the applicant. The terms contained in any final award documents may differ from the terms of the PMT being announced today.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
10/10/2025 | Nolan Johnson, I-Connect007I-Connect007 has a new monthly digest newsletter, the Advanced Electronic Packaging Digest, and as I was scanning our advanced packaging newsfeeds this week, I came across a primer from tokenring.ai (republished through station WRAL, Raleigh, North Carolina), which I found quite useful. Whether you’re a designer, fabricator, or assembler, the package schemes being developed will change how you work, so be sure to keep your eye on the technological horizon and subscribe to the monthly Advanced Electronic Packaging Digest.
Intel Shares Surge Following Report of Early Talks to Make Chips for Rival AMD
10/03/2025 | I-Connect007 Editorial TeamIntel shares jumped on October 1, following reports that the company is in early talks to manufacture chips for rival AMD through its foundry business, according to CNBC.
Technica Hosts In-House Visit from PCBAA
10/01/2025 | Technica USADavid Schild, Executive Director of PCBAA (Printed Circuit Board Association of America) visited Technica USA to discuss the activity in the market and the advocacy of the PCBAA. The organization was formed to work on Capitol Hill, educating, advocating and getting congressional support to legislate on behalf of building a stronger PCB and substrate manufacturing base in the U.S.A.
European Semiconductor Industry Endorses Semicon Coalition's Call for Revised EU Chips Act - Cloned
09/30/2025 | SEMISEMI Europe, along with over 75 semiconductor and microelectronics companies, research and technology organizations (RTOs) and trade associations, officially endorse the Declaration of the Semicon Coalition.
Empower Sets New Benchmark with 20x Faster Response and Breakthrough Sustainability Demonstrated at OCP Global Summit 2025
09/25/2025 | Empower SemiconductorEmpower Semiconductor, the world leader in powering AI-class processors, announced that its Crescendo chipset, an artificial intelligence (AI) and high-performance computing (HPC) processor true vertical power delivery platform, is available now for final sampling, with mass production slated for late 2025.