The Marketing Minute: Marketing With Layers
The Right Approach: Electro-Tek—A Williams Family Legacy, Part 1
It’s Only Common Sense: If You’re Not Differentiated, You’re Dead
IPC Hall of Fame Spotlight Series: Highlighting Doug Pauls
February 12, 2025 | Dan Feinberg, Technology Editor, I-Connect007Estimated reading time: 2 minutes
Editor’s note: Dan Feinberg continues his series on the IPC Hall of Fame, spotlighting the achievements of past Hall of Fame members.
Over the years, IPC members who have contributed significantly to IPC and our industry have been awarded the IPC Raymond E. Pritchard Hall of Fame (HOF) Award. Though many early HOF members have passed away and are unknown to today’s IPC membership, their contributions still resonate. This special series on IPC Hall of Fame members provides a reminder of who was honored and why. As a bonus, for those who are still around, we get to find out what these talented individuals are up to today.
This month, I highlight Doug Pauls, who was awarded the Hall of Fame Award in 2016. He had previously received the IPC’s President’s Award. When he was inducted into the Hall of Fame, Doug was the principal materials and process engineer at Rockwell Collins.
Doug was working for Naval Avionics (a designation used for a U.S. Naval facility) in 1985 when his company sent him to his first IPC meeting. He immediately got involved with the Solder Mask Task Group, soon becoming vice chair. He offers thanks and credit to Susan Mansilla, who introduced him to his first committee and got him involved on day one. He continued and increased his involvement, helping to advance the IPC goals and objectives, thereby benefitting the entire electronics industry. Over the years, he has been involved in at least 50 task groups.
Doug served as chair of IPC’s Conformal Coatings Requirements Task Group and had previously served on the Cleaning and Coating Committee for 10 years. He was an instrumental contributor to IPC-CC-830, Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies, as well contributing to the development and revision of IPC-HDBK-830, Guidelines for Design, Selection, and Application of Conformal Coatings. He led IPC efforts in bare board cleanliness, solder mask, surface insulation resistance (SIR), chemical characterization, conformal coating, cleaning processes, and materials and process compatibility testing.
Additionally, Doug served as a U.S. representative to ISO and IEC working groups on SIR and electro-migration reliability standards and participated in numerous national and international consortia on electronics manufacturing materials and processes.
Doug feels that his greatest achievement for IPC and the industry was his involvement in 2018 culminating in the “How clean is clean?” IPC-J-001 standard. He feels that his deep involvement in IPC not only helped IPC and the industry but provided him with an amazing platform for continuous learning throughout his career. It was also a significant benefit to his employer.
Though now semi-retired, Doug says that his time and experience working with IPC and all that he learned throughout his career allows him to continue giving back to the industry in significant ways through his consulting work.
Thank you, Doug Pauls, for your significant contributions over the years and your continued work today.
This article appeared in the January 2025 issue of PCB007 Magazine.
Share on:
Testimonial
"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."
Simon Khesin - Schmoll MaschinenSuggested Items
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
New Course Presents a Comprehensive Guide to IPC Standards
10/10/2025 | Marcy LaRont, I-Connect007Francisco Fourcade, electronics technology standards manager for the Global Electronics Association, has spent years helping companies understand and implement the standards that keep the electronics manufacturing industry moving forward. In this interview, he shares updates on ongoing standards development efforts and previews a new course, "IPC Standards: A Guide for the Electronics Industry,” which starts Oct. 14.
North American EMS Industry Shipments Down 1.4% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.26.
North American PCB Industry Sales Up 12.8% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 0.98.
Industry Leaders Shape a Sustainable Future at 2025 IPC CEMAC Electronics Manufacturing Annual Conference
09/30/2025 | Global Electronics AssociationThe 2025 IPC CEMAC Electronics Manufacturing Annual Conference, co-hosted by the Global Electronics Association and the Shanghai Pudong Association for Quality and Technology, successfully concluded on September 26 in Shanghai.