Global Citizenship: Redefining Connection and Responsibility in Digital Transformation
The Marketing Minute: Strategic Short-form Content Builds Brand Momentum
SMT Perspectives and Prospects: Artificial Intelligence, Part 5: Brain, Mind, Intelligence
PARMI USA to Unveil Xceed II AOI System at IPC APEX EXPO 2025
February 18, 2025 | PARMI USAEstimated reading time: 1 minute
PARMI USA, INC., a leader in advanced 3D inspection systems, is excited to announce the launch of its next-generation 3D Automated Optical Inspection (AOI) system, the Xceed II, at the 2025 IPC APEX EXPO, scheduled to take place March 18-20, 2025 at the Anaheim Convention Center in Anaheim, California. The Xceed II will be featured at Booth 910, where PARMI will showcase its latest advancements in inspection technology.
The Xceed II features an enhanced platform designed to improve inspection speed and quality. This new system incorporates the TRSC-II sensor, delivering superior 2D/3D data quality and offering five different resolution settings, from high precision (4 µm, 6 µm, 7 µm) for detailed inspection to high-speed settings (10 µm, 14 µm) for faster throughput.
A key highlight of the Xceed II is its optimization for die inspection, including System in Package (SiP), bare die, IPD, die attach, underfill fillet, and Cu Clip on die. This makes it the ideal solution for inspecting complex components found in next-generation electronics. Additionally, the system enhances 2D die inspection through advanced coaxial lighting, enabling more types of defect detection on the die’s top surface, including text, polarity, cracks, contamination, chipping, and epoxy issues.
“We are excited to showcase the Xceed II at IPC APEX EXPO 2025,” said Juan Arango, Head of Sales and Business Development at PARMI USA. “The improvements in speed, precision, and die inspection optimization make the Xceed II the most advanced AOI system for today’s high-demand, high-precision manufacturing environments.”
Visit PARMI USA at Booth 910
PARMI USA invites industry professionals to experience the Xceed II firsthand at Booth 910 during the upcoming IPC APEX EXPO. Attendees will have the opportunity to explore how the Xceed II can enhance inspection efficiency, reduce defects, and improve production processes.
Visit PARMI at IPC APEX EXPO 2025
Attendees at IPC APEX EXPO 2025 are invited to Booth 910 to learn more about the Xceed II and explore how PARMI's inspection solutions can transform their manufacturing processes.
Share on:
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
04/18/2025 | Andy Shaughnessy, Design007 MagazineIt’s been a busy week in our industry. Never a dull moment! If you’ve been paying attention to our tariff tumult with China and its effect on the stock market, especially if your company does a lot of business with China, you might be tempted to call in a Xanax refill about now. But hang tight. This is still early in the first quarter. This brouhaha serves to underscore our need to manufacture critical laminates and components in the U.S. In this week’s must-reads, we have a potpourri of articles covering tariffs, the next generation of HDI, the three-year anniversary of IPC Mexico, a novel green technology, and emerging design trends.
Real Time with... IPC APEX EXPO 2025: Aster–Enhancing Design for Effective Testing Strategies
04/18/2025 | Real Time with...IPC APEX EXPOWill Webb, technical director at Aster, stresses the importance of testability in design, emphasizing early engagement to identify testing issues. This discussion covers the integration of testing with Industry 4.0, the need for good test coverage, and adherence to industry standards. Innovations like boundary scan testing and new tools for cluster testing are introduced, highlighting advancements in optimizing testing workflows and collaboration with other tools.
IPC President’s Award: Xaver Feiner
04/17/2025 | Nolan Johnson, SMT007 MagazineThroughout his career, Xaver Feiner, vice president of marketing and sales at Zollner Elektronik, has developed extensive expertise in account management and new business development with a strong focus on the semiconductor industry, aerospace, and industrial electronics. Xaver has cultivated a profound understanding of global markets and remains deeply engaged with the challenges and opportunities presented by digital transformation. Since 2020, he has been an active member of the IPC Europe Advocacy Group, where he is dedicated to advancing the position of the electronics industry and the EMS sector across Europe.
New High Power 3D AXI for Power Electronics from Test Research, Inc.
04/17/2025 | TRITest Research, Inc. (TRI), a leading provider of Test and Inspection solutions for the electronics manufacturing industry, proudly announces the launch of the 3D AXI TR7600HP system. Designed for power semiconductor inspection, the TR7600HP enhances accuracy and efficiency in detecting defects in components such as IGBTs, MOSFETs, SiC inverters, and Paladin Connectors.
IPC APEX EXPO 2025 Learning Lounge: Education on the Show Floor
04/16/2025 | Andy Shaughnessy, Design007The conference portion of IPC APEX EXPO has been providing educational opportunities for attendees since the first show. But recently, show managers decided to expand education onto the show floor.