The Chemical Connection: Onshoring PCB Production—Daunting but Certainly Possible
Marcy’s Musings: The Legislative Outlook—Helping or Hurting?
It’s Only Common Sense: The Phone Is Still Mightier Than the Keyboard
Aismalibar to Showcase Advanced Thermal Management Solutions at APEC 2025
March 13, 2025 | AismalibarEstimated reading time: 2 minutes
Aismalibar, a global leader in high-performance thermal management materials, is set to exhibit at APEC 2025 (Applied Power Electronics Conference) in Atlanta, Georgia, from March 16–20, 2025. As the premier event for power electronics professionals, APEC provides a crucial platform for industry leaders to explore the latest advancements in thermal interface materials (TIMs), high-performance PCB laminates, and insulated metal substrates (IMS).
Aismalibar will be showcasing cutting-edge thermal management solutions at Booth 338, including new developments in TIMs and thermally conductive PCB laminates for multilayer PCBs and IMS applications. These materials are engineered to optimize heat dissipation, improve dielectric insulation, and enhance the reliability of power electronics systems.
Advanced Thermal Interface Materials (TIMs) for Power Electronics
Aismalibar’s TIM portfolio is designed to address the critical need for efficient thermal transfer while ensuring electrical insulation when required. Our TIM solutions are classified based on dielectric capacity, which is determined by the device’s operating voltage and regulatory insulation requirements. Additionally, Aismalibar has developed self-adhesive and non-adhesive surface treatments to minimize air gaps between the TIM, heatsinks, and electronic components, thereby enhancing thermal transfer efficiency.
Glass-Free Thermally Conductive PCB Dielectric for High-Power Applications
Aismalibar introduces a next-generation, glass-free, thermally conductive dielectric for single-sided and multilayer PCBs. This innovative material provides:
- Thermal conductivity up to 10 W/mK, significantly improving heat dissipation compared to traditional laminates.
- Dielectric thickness options ranging from 50 to 200 microns, ensuring versatility across different PCB configurations.
- High dielectric strength (3 – 10 kV), providing robust electrical insulation without sacrificing thermal efficiency.
By eliminating glass reinforcements, this glass-free bond sheet achieves superior thermal conductivity and mechanical flexibility, making it ideal for power electronics, automotive, and high-reliability applications.
IMS Metal Clad Substrates for High-Power Applications
Aismalibar’s IMS (Insulated Metal Substrate) solutions feature a thick aluminum base, laminated with ED copper foil, providing:
- Superior thermal dissipation, reducing hotspots and improving system longevity.
- High electrical insulation, achieved through Aismalibar’s proprietary polymer-ceramic formulation.
- Compatibility with standard PCB manufacturing processes, enabling seamless integration without additional thermal management components.
Aismalibar’s IMS technology offers a cost-effective, high-performance alternative to conventional heat dissipation solutions, allowing direct SMD assembly and enhanced thermal endurance for automotive, industrial power modules, and LED lighting applications.
Visit Aismalibar at APEC 2025 – Booth 338
We invite PCB design engineers, thermal management specialists, and power electronics professionals to visit Booth 338 to explore our latest advancements in thermally optimized PCB laminates, TIMs, and IMS solutions. Our team will be available to discuss how Aismalibar materials can enhance performance, extend component lifespan, and improve overall system efficiency.
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Peters Spotlights ELPEPCB® HSP 801 S at productronica
10/22/2025 | PetersThe ELPEPCB® HSP 801 S heatsink paste is considered a premium product for Peters when exhibiting at the upcoming productronica. At the world’s leading trade fair for electronics development and manufacturing which will take place in Munich from November 18 to 21, 2025.
Indium Expert to Present on Advancing Thermal Performance at TestConX China
10/21/2025 | Indium CorporationIndium Corporation Assistant Product Manager Foo Siang Hooi will deliver a technical presentation at TestConX China, to be held November 13 in Shanghai. He will focus on advancing thermal performance in high-performance computing, automotive electronics, and power semiconductor applications with an innovative thermal interface material (TIM).
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Advanced Semiconductor Packaging Market Sees Rising Adoption Across Automotive and Industrial Sectors
10/14/2025 | openPRThe semiconductor packaging market size is estimated to reach at a CAGR of 7.2% during the forecast period (2024-2031).
Beyond Thermal Conductivity: Exploring Polymer-based TIM Strategies for High-power-density Electronics
10/13/2025 | Padmanabha Shakthivelu and Nico Bruijnis, MacDermid Alpha Electronics SolutionsAs power density and thermal loads continue to increase, effective thermal management becomes increasingly important. Rapid and efficient heat transfer from power semiconductor chip packages is essential for achieving optimal performance and ensuring long-term reliability of temperature-sensitive components. This is particularly crucial in power systems that support advanced applications such as green energy generation, electric vehicles, aerospace, and defense, along with high-speed computing for data centers and artificial intelligence (AI).