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From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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Welcome to the debut issue of I-Connect007 Magazine. This publication brings all of the pieces together from PCB design and fabrication for a closer alignment and a more integrated electronics manufacturing landscape.
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Technica USA and CBT Introducing TiTAN Hybrid at IPC APEX EXPO 2025
March 18, 2025 | Technica USAEstimated reading time: Less than a minute
The wait is over! Technica and CBT are proud to unveil TiTAN Hybrid, a groundbreaking innovation set to redefine the PCB industry. Designed for unmatched performance, efficiency, and adaptability, this cutting-edge laser imaging technology brings the future to you—today.
Advantages of LED-Laser Hybrid Systems
- Enhanced Processing Speed – Hybrid exposure systems reduce PCB production time
- Energy Efficiency – LED technology reduces power consumption compared to traditional UV lamps
- Longer Lifespan – LED and laser sources have longer operational life, minimizing maintenance
- Higher Precision – Laser provides fine resolution, while LEDs ensure uniformity
- Eco-Friendly – No mercury (as in traditional UV lamps) and lower heat emission
The TiTAN Hybrid will provide customers with the industry's most consistent, accurate, repeatable, and productive direct imaging solution available at a very affordable price.
Technica USA invites customers to visit their booth #4110 to see the TiTAN Hybrid and learn more about CB Tech's exciting technology roadmap. During the show, the TiTAN Hybrid will be interacting with the SAA automation system.
See the TiTAN-Hybrid in action at IPC APEX EXPO in Technica’s booth, #4110!
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Sweeney Ng - CEE PCBSuggested Items
RTX Collins Aerospace Completes Clean Aviation HECATE Project
03/19/2026 | RTXCollins Aerospace, an RTX business, announces the successful completion of the HECATE project, part of the European Union's Clean Aviation Joint Undertaking with support from UK Research and Innovation.
RTX's Collins Aerospace Initiates Powertrain Testing for Clean Aviation SWITCH Project at the Grid
03/18/2026 | RTXCollins Aerospace has begun initial testing of the electric motor drive systems for the European Union's Clean Aviation SWITCH project, a key step towards demonstrating the hybrid-electric technology on a full-scale Pratt & Whitney GTF™ engine.
SMTA WLPS 2026 Review: Shifting Microelectronic Package Development
03/11/2026 | Vern Solberg, ConsultantThe Surface Mount Technology Association (SMTA) hosts a number of timely events each year to focus on key technologies. The most recent, the 2026 Wafer-Level Packaging Symposium, held in San Francisco this February, brought together prominent technologists and manufacturers involved in microelectronic package development and related infrastructure.
DOCOMO, NEC Launch Japan's First Commercial 5G Core on AWS
03/02/2026 | JCN NewswireNTT DOCOMO, INC. and NEC Corporation announced the launch of Japan’s first commercial 5G core network (5GC) on Amazon Web Services (AWS) on February 26.
Quantum Machines to Establish Flagship Hub at the Illinois Quantum and Microelectronics Park
02/05/2026 | PRNewswireThe Illinois Quantum and Microelectronics Park (IQMP) and the Illinois Economic Development Corporation announced that Quantum Machines will establish a flagship hub at the Park.