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Insulectro & Dupont Host Technology Symposium at Silicon Valley Technology Center June 25

06/22/2025 | Insulectro
Insulectro, the largest distributor of materials for use in the manufacture of PCBs and printed electronics, and DuPont, a major manufacturer of flex laminates and chemistry, invite fabricators, OEMS, designers, and engineers to attend an Innovation Symposium – Unlock the Power - this Wednesday, June 25, at DuPont’s Silicon Valley Technology Center in Sunnyvale, CA. 

All Flex Solutions Upgrades Lamination Layup

06/19/2025 | All Flex Solutions
All Flex Solutions has invested in Ulrich Rotte lamination layup stations in their rigid flex layup area. The Ulrich Rotte stations automate the layup process by handling the lamination plates, which are heavy, and sequencing the layup process for the operators.

SEMI FlexTech Solicits Proposals for Advancing the Future of Flexible Hybrid Electronics

06/18/2025 | SEMI
FlexTech, a SEMI Technology Community, today issued a Request for Proposals (RFP) to advance flexible hybrid electronics (FHE) technologies, including the development of advanced materials and additive processing.

Flex CEO Sees US Manufacturing Resurgence

06/18/2025 | I-Connect007
In a June 16 interview on Bloomberg Open Interest, Flex CEO Revathi Advaithi said the supply chain is already shifting, with more goods now being manufactured in the U.S.

American Standard Circuits to Exhibit at IMS 2025

06/12/2025 | American Standard Circuits
Anaya Vardya, President and CEO of American Standard Circuits & ASC Sunstone Circuits, announced that his companies will exhibit at the IEEE International Microwave Symposium (IMS 2025), taking place June 15-20, 2025, at San Francisco’s Moscone Center.
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