Marcy’s Musings: Operating Without a Rulebook
It’s Only Common Sense: Hire for Hunger, Train for Skill
Dan’s Biz Bookshelf: ‘The 'NVIDIA Way: Jensen Huang and the Making of a Tech Giant’
Ventec International Group Enters into a Fulfillment and Supply Agreement with Matrix and Launches Ventec Americas
June 9, 2025 | Ventec International GroupEstimated reading time: Less than a minute
Ventec is excited to announce a new partnership with Matrix aimed at enhancing the fulfillment, value-added conversion, and distribution of PCB base materials across the North American market. This collaboration is set to significantly improve supply chain efficiency, and delivery performance for the company's North American customers.
The synergies created by our partnership will benefit all of their North American customers through their enhanced Just-In-Time (JIT) and logistics model, supported by the company's five (5) rapid-response warehouses.
Starting June 9th 2025, they will offer expedited delivery of Ventec’s range of Polyimide, FR4, FR4.1 & FR15.1 materials through the Santa Ana warehouse. Over the next few months, Ventec will ramp up operations and extend expedited delivery services to additional locations, ensuring broader and faster access to our high-quality materials.
Stay tuned for updates as they continue to enhance our distribution network.
Share on:
Testimonial
"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."
Simon Khesin - Schmoll MaschinenSuggested Items
Lockheed Martin Ships 2nd Aegis Vessel Set with AN/SPY-7 Radar to Japan
03/16/2026 | Lockheed MartinLockheed Martin, successfully delivered the second Aegis System Equipped Vessel (ASEV) shipset of AN/SPY-7(V)1 radar equipment to the Japan Ministry of Defense (JMOD).
Henger Announces Delivery of 400 Plasma Equipment Units and Launch of Their Second Plant
11/14/2025 | HengerZhuhai Henger Microelectronics Equipment Co., Ltd. announced the successful delivery of its 400th PCB plasma equipment unit and the official inauguration of the plasma workshop at its second plant on November 11. These milestones mark a significant advancement in the company’s technological development and production capacity.
PDN Optimization: Balancing Performance and Cost in SoC Designs
10/22/2025 | Zach Caprai. Siemens EDAThis article demonstrates advanced PDN optimization techniques through a real-world case study of AMD’s Versal adaptive SoC platform. Using the VCK190 evaluation kit featuring the Versal AI Core series VC1902 device, I’ll explore how effective PDN design and optimization can help meet demanding technical specifications while addressing essential business goals.
Empower Sets New Benchmark with 20x Faster Response and Breakthrough Sustainability Demonstrated at OCP Global Summit 2025
09/25/2025 | Empower SemiconductorEmpower Semiconductor, the world leader in powering AI-class processors, announced that its Crescendo chipset, an artificial intelligence (AI) and high-performance computing (HPC) processor true vertical power delivery platform, is available now for final sampling, with mass production slated for late 2025.
Advint Incorporated Brings Artificial Intelligence to Electroplating Training
09/11/2025 | Advint IncorporatedAdvint Incorporated is introducing a new dimension to its electroplating training programs: the integration of Artificial Intelligence (AI). This initiative reflects the company’s commitment to providing PCB fabricators and manufacturers in the USA and Canada with training that is practical, forward-looking, and directly relevant to today’s production challenges.