Dan’s Biz Bookshelf: ‘The Next RenAIssance: AI and the Expansion of Human Potential’
The Chemical Connection: When the Industry Moves Faster Than the Standards
Driving Innovation: Selecting the Right Laser Source
Summit Interconnect Participates in PCBAA Annual Meeting to Advance U.S. Electronics Policy
June 26, 2025 | Summit Interconnect, Inc.Estimated reading time: 1 minute
Summit Interconnect was proud to participate in the 2025 Annual Meeting of the Printed Circuit Board Association of America (PCBAA), held in Washington, D.C. this June. The event drew record attendance and demonstrated strong momentum for the U.S. printed circuit board and substrates industry, with impactful engagement from both government and industry leaders.
As a founding member of PCBAA, Summit Interconnect is deeply invested in strengthening the domestic PCB supply chain. Our CEO, Shane Whiteside, currently serves as Chairman and plays an active role in guiding the organization’s strategic direction and advocacy efforts. John Vaughan, Vice President of Strategic Markets at Summit, also serves as PCBAA Membership Chair.
This year’s meeting brought together Members of Congress, Department of Commerce officials, defense primes, OEM executives, and representatives from across the electronics manufacturing sector. A core focus was advancing bipartisan support for the Protecting Circuit Boards and Substrates Act (PCBs Act)—a critical piece of legislation aimed at revitalizing the U.S. electronics manufacturing base.
As part of the event, PCBAA representatives conducted over two dozen meetings on Capitol Hill, securing new Congressional co-sponsors for the PCBs Act and reinforcing the importance of onshoring production of mission-critical technologies.
The annual meeting continues to serve as a vital platform for uniting policymakers and industry stakeholders in a shared mission: ensuring that the United States remains globally competitive in the design and manufacturing of printed circuit boards, substrates, and advanced electronic systems.
At Summit Interconnect, we are honored to contribute to this movement. We remain committed to promoting policies that secure the U.S. electronics ecosystem and safeguard the future of domestic innovation.
Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Summit Interconnect Marks 10 Years of Precision Manufacturing
04/03/2026 | Summit Interconnect, Inc.Summit Interconnect, the largest privately held printed circuit board (PCB) manufacturer in North America, marks its tenth anniversary, a milestone that reflects a decade of bold acquisitions, pioneering technology investments, and an enduring mission: to enable customer success through the highest-reliability PCB manufacturing on the continent.
My Top 7 Takeaways from APEX EXPO 2026
04/03/2026 | Chris Mitchell, VP of Global Government Relations, Global Electronics AssociationI’m back from APEX EXPO 2026 in Anaheim, California, and it was another great year. Even amid significant global volatility, the industry is growing, innovating, and building partnerships. As I reflect on the experience, I want to share my top 7 takeaways and explain why each matters. First is this year’s Advanced Electronics Packaging Conference (AEPC) , which delivered outstanding, peer-reviewed content and strong participation, reflecting how central advanced electronics packaging has become across the industry.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
02/27/2026 | Marcy LaRont, I-Connect007 MagazineIt’s time for my five must-reads featured this past week. The global economy is still reeling from last Friday’s U.S. Supreme Court ruling that most tariffs imposed under IEEPA by President Trump are unconstitutional. In other news, with APEX EXPO just two weeks away, we're featuring the first three Real Time with... pre-show sponsor interviews: Remtec, Burkle North America, and KYZEN. These are insightful and forward-thinking interviews about what you can expect to see at the show this year. Please check them out!
Growing an Engineer: Meet Emerging Engineer Julian Vega
02/25/2026 | Marcy LaRont, I-Connect007 MagazineJulian Vega started as a 17-year-old intern who rose to planning supervisor at Summit Interconnect in just seven years, and credits the Global Electronics Association’s Emerging Engineer program for fueling his passion and accelerating his career journey. In this interview, Julian shares how the program expanded his technical perspective, connected him with industry leaders, and helped shape his vision for the future.
Siemens Wins Best of Show Award for ‘Packaging: Design’ at 2026 Chiplet Summit
02/23/2026 | SiemensSiemens has won in the “Packaging: Design” category at the 2026 Chiplet Summit Best of Show Awards for its Innovator3D IC™ solution.