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Suggested Items

Summit Interconnect Celebrates 10 Years

07/28/2026 | Marcy LaRont, I-Connect007 Magazine
Ten years ago, Shane Whiteside had a vision for the dwindling North American PCB industry: to develop a company at scale that would put North American PCB manufacturing back on the map. The result was the combination of six PCB organizations and complementary businesses to create Summit Interconnect, now the second-largest PCB manufacturer in North America. In this interview, Summit CEO Shane Whiteside and Vice President of Technology Gerry Partida reflect on Summit's 10th anniversary, the pride they take in what they've built, and the enthusiasm they still bring to the business as they celebrate this milestone.

Apprenticeship Summit Highlights Electronics Workforce ‘Puzzle’

05/27/2026 | Victoria Hawkins, Global Electronics Association
Last week, I had the opportunity to attend the 2026 Apprenticeships for America Summit in Washington, D.C., and it was both energizing and informative to be surrounded by so many leaders working to strengthen and scale apprenticeships across the country. The summit brought together employers, intermediaries, workforce leaders, educators, policy experts, and apprenticeship advocates to discuss some of the most important topics in our field

SEMI 3D & Systems Summit to Advance AI, Hybrid Bonding, and Chiplet Ecosystem

05/06/2026 | SEMI
Global experts in advanced semiconductor packaging and 3D integration will convene at the annual SEMI 3D & Systems Summit, June 17–19, 2026, in Dresden, Germany.

U.S. Semiconductor Industry Convenes at Glass4Chips Summit

05/04/2026 | NY CREATES
The 2026 Glass4Chips Summit will bring together leaders and innovators across industry, academia, and government to address a framework for accelerating the adoption of glass substrates in next-generation semiconductor manufacturing and packaging.

My Top 7 Takeaways from APEX EXPO 2026

04/03/2026 | Chris Mitchell, VP of Global Government Relations, Global Electronics Association
I’m back from APEX EXPO 2026 in Anaheim, California, and it was another great year. Even amid significant global volatility, the industry is growing, innovating, and building partnerships. As I reflect on the experience, I want to share my top 7 takeaways and explain why each matters. First is this year’s Advanced Electronics Packaging Conference (AEPC) , which delivered outstanding, peer-reviewed content and strong participation, reflecting how central advanced electronics packaging has become across the industry.
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