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MKS Showcases Next-generation PCB Manufacturing Solutions at the Thailand Electronics Circuit Asia 2025
August 6, 2025 | MKS Instruments, Inc.Estimated reading time: 2 minutes
MKS Inc, a global provider of enabling technologies that transform our world, today announced its participation in Thailand Electronics Circuit Asia 2025 (THECA 2025), taking place August 20–22 at BITEC in Bangkok. Under its strategic brands Atotech® (process chemicals, equipment, software, and services) and ESI® (laser systems), MKS will present its latest innovations for printed circuit board (PCB) and package substrate manufacturing.
MKS’ Atotech and MKS’ ESI brand representatives will be available at BITEC, booth H17, where the company will showcase recent developments in lasers, optics, motion control, process chemistry, and advanced equipment—technologies that are shaping the future of PCB manufacturing. These highlights will provide visitors insights into how MKS is addressing interconnect challenges and enabling next-generation miniaturized electronics with precision and highest reliability.
Thomas Beck, Vice President & General Manager Southeast Asia, highlights Thailand’s advantageous position and well-developed infrastructure as key drivers of its regional prominence. The country’s seamless connectivity and supportive regulatory environment continue to strengthen its role as a hub for agile supply chains and expanded market reach across Asia-Pacific. As the electronics industry shifts from conventional MLB/HDI automotive uses to new and emerging sectors, MKS’ Atotech and MKS’ ESI stay at the forefront delivering cutting-edge solutions and expert guidance to help customers navigate this evolving landscape.
On August 21 at 10:30 a.m., Daniel Schmidt, Global Marketing and Training Director, will deliver a keynote presentation providing key insights into global and regional market trends, as well as workforce development needs shaping the electronics industry.
Following his presentation, at 11:00 a.m., Jimmy Kan, OEM Manager, will take the stage to present the latest developments in next-generation PCB technologies, with a focus on innovations driving AI, high-performance computing (HPC) servers, and data centers.
All visitors are warmly invited to attend these sessions and gain valuable insights into the future of the industry.
Chemical process highlights include the following featured MKS’ Atotech products:
- Aurotech® G-Bond 3: New versatile gold bath for nickel/gold, nickel/palladium/gold and palladium/gold plating.
- Inpulse® 2HF9: Delivers superior BMV filling with minimal surface copper plating, excellent planarity, high productivity, and proven reliability for mass HDI production
- Printoganth® U Plus: Industry standard for HDI PCBs, offering excellent copper-to-copper interconnections under severe thermal shock and meeting top reliability standards from leading automotive and smartphone OEMs.
- NovaBond® PX-S2: Improves PCB performance by using selective nano-roughening and chemical adhesion to ensure superior signal integrity and thermal reliability without changing trace geometry.
- OS-Tech®SIT2: Organic surface finish offers a solderable, eco-friendly option for electronics, ensuring multiple reflow cycles and compatibility with Atotech’s ENIG processes, with coating thickness as a key quality control measure.
Equipment highlights include:
- Uniplate® PLB Cu6 (for mSAP): Industry leading and high energy-efficient horizontal equipment solution for producing reliable fine-line interconnects with superior copper plating performance and minimized handling requirements.
- Geode™ platform solutions: Next generation PCB and advanced substrate CO2 and UV laser via drills.
- Capstone™: Flex PCB UV drilling tool for high-performance breakthrough productivity.
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