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The Legislative Outlook: Helping or Hurting?
This month, we examine the rules and laws shaping the current global business landscape and how these factors may open some doors but may also complicate business operations, making profitability more challenging.
Advancing the Advanced Materials Discussion
Moore’s Law is no more, and the advanced material solutions to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
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Coming Soon: The Advanced Electronics Packaging Digest
August 27, 2025 | Marcy LaRont, I-Connect007Estimated reading time: 1 minute
The upcoming Advanced Electronics Packaging Digest is a curated, condensed monthly publication designed to keep you informed and engaged with the fast-moving world of advanced electronics packaging (AEP).
In our inaugural September issue, we will begin at the foundation with an in-depth interview featuring Matt Kelly, CTO of the Global Electronics Association. Kelly and his Technology Solutions Team approach advanced packaging from a holistic systems perspective. In this interview, he explains the concepts and tactical realities behind the term “advanced electronics packaging,” emphasizing why a systems approach is critical to developing reliable, scalable, and sustainable solutions. With billions of dollars riding on this sector of electronics manufacturing, and mounting pressure to meet unprecedented demand for modern electronic products, data processing, and storage, Kelly makes a compelling case for getting it right early in the process.
Also included in this first issue:
- A recent Global Electronics Association white paper that more fully explains the concept of advanced electronics packaging
- The first installment in a new series from automotive and EV expert Stanton (Stan) Rak, who explores the rapidly evolving technology requirements in automotive electronics, both current and future
- A curated selection of recent news highlights
- A global events calendar dedicated to advanced packaging, ensuring you have the latest resources at your fingertips
Looking ahead, our October issue will launch a new series of company and personnel spotlights, showcasing the innovators driving progress in this complex and highly technical field. We’ll also feature insights from a supplier focused on PCB and interconnect solutions designed to address one of the industry’s greatest challenges: thermal management in advanced packaging designs.
We invite you to subscribe today to stay informed and connected. If you’re interested in contributing to the digest or would like to suggest topics for future coverage, please reach out to marcy@iconnect007.com.
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