-
- News
- Books
Featured Books
- I-Connect007 Magazine
Latest Issues
Current Issue
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
- Articles
- Columns
- Links
- Media kit
||| MENU - I-Connect007 Magazine
Coming Soon: The Advanced Electronics Packaging Digest
August 27, 2025 | Marcy LaRont, I-Connect007Estimated reading time: 2 minutes
The upcoming Advanced Electronics Packaging Digest is a curated, condensed monthly publication designed to keep you informed and engaged with the fast-moving world of advanced electronics packaging (AEP).
In our inaugural September issue, we will begin at the foundation with an in-depth interview featuring Matt Kelly, CTO of the Global Electronics Association. Kelly and his Technology Solutions Team approach advanced packaging from a holistic systems perspective. In this interview, he explains the concepts and tactical realities behind the term “advanced electronics packaging,” emphasizing why a systems approach is critical to developing reliable, scalable, and sustainable solutions. With billions of dollars riding on this sector of electronics manufacturing, and mounting pressure to meet unprecedented demand for modern electronic products, data processing, and storage, Kelly makes a compelling case for getting it right early in the process.
Also included in this first issue:
- A recent Global Electronics Association white paper that more fully explains the concept of advanced electronics packaging
- The first installment in a new series from automotive and EV expert Stanton (Stan) Rak, who explores the rapidly evolving technology requirements in automotive electronics, both current and future
- A curated selection of recent news highlights
- A global events calendar dedicated to advanced packaging, ensuring you have the latest resources at your fingertips
Looking ahead, our October issue will launch a new series of company and personnel spotlights, showcasing the innovators driving progress in this complex and highly technical field. We’ll also feature insights from a supplier focused on PCB and interconnect solutions designed to address one of the industry’s greatest challenges: thermal management in advanced packaging designs.
We invite you to subscribe today to stay informed and connected. If you’re interested in contributing to the digest or would like to suggest topics for future coverage, please reach out to marcy@iconnect007.com.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Kimball Electronics Reports Q3 Results With Double-Digit Sequential Medical Sales Growth
05/07/2026 | Kimball ElectronicsKimball Electronics, Inc. announced financial results for the third quarter ended March 31, 2026.
Hall of Fame Spotlight Series: Highlighting Karen McConnell
05/07/2026 | Dan Feinberg, I-Connect007In 2021, Karen McConnell was awarded the Raymond E. Pritchard Hall of Fame award in recognition of her contributions to the Association and the electronics industry. As a senior staff member and CAD/CAM engineer at Northrop Grumman Enterprise Services, her primary responsibility was to develop a common, shared EDM (Electronic Document Management) library to support the electrical and PCB design tool initiatives across Northrop Grumman Mission Systems.
IMI Reports Stronger Performance and Return to Profitability in 2025
05/06/2026 | IMIIntegrated Microelectronics, Inc. (IMI) reported a significantly improved performance in 2025, reflecting the positive results of its multi year transformation focused on operational efficiency, portfolio optimization, and strengthening core capabilities.
Incap Group Reports Q1 2026 Revenue Growth and Completion of Lacon Acquisition
05/06/2026 | IncapIncap estimates that the company’s revenue and comparable EBITA in 2026 will be clearly higher than in 2025. The estimates include the impact of Lacon’s acquisition and are given provided that unexpected events impacting Incap’s business environment do not occur.
ITW EAE Appoints AMS as Distributor for MPM Printers and Camalot Dispensers in the UK and Ireland
05/06/2026 | ITW EAEITW EAE is pleased to announce the appointment of AMS as the authorized distributor of MPM Printer and Camalot Dispenser products for the United Kingdom and Ireland territory.