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What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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Aismalibar North America Showcases Advanced Thermal Management Solutions at The Battery Show North America 2025
September 18, 2025 | AismalibarEstimated reading time: 1 minute
Aismalibar North America, a leader in high-performance thermal management solutions, will present its latest innovations at The Battery Show North America and Electric & Hybrid Vehicle Technology Expo 2025 in Detroit, Michigan, October 6–9, 2025, where attendees can meet the team at Booth #5929 to explore materials engineered for demanding EV and high-power electronics.
Featured Innovations
- COBRITHERM ALP – A thermally conductive/dielectric aluminum substrate combining high dielectric strength (up to 10 kV) with superior thermal conductivity (2.2–3.2 W/mK). Ideal for EV batteries, telecom, and high-voltage systems, it reduces assembly time and cost while supporting automated PCB assembly.
- THIN LAM – Thermal FR4 for Multilayer PCBs – Optimized for SiC and GaN devices, THIN LAM lowers device temperatures by ~20°C compared to standard FR4, delivers >7% higher power throughput, and eliminates the need for thermal vias, improving reliability and simplifying PCB design.
- AirGapFiller for better heat flow in Electronic Power Modules – A surface-adaptive coating that fills microscopic voids at just 35–40°C to improve thermal contact, reduce resistance, and enhance heat dissipation in electronic power modules.
- Bond Sheet Cured (Glass-Free) – A high-performance insulation and thermal transmission material offering dielectric strength up to 10 kV, thermal conductivity up to 3.2 W/mK, and ultra-low thermal resistance (as low as 0.031 K/W). Clean, flexible, and fiber-free, it ensures long-term stability in demanding EV and industrial applications.
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Julia McCaffrey - NCAB GroupSuggested Items
Teledyne FLIR Defense Wins $35+ Million Surveillance System Contract for Reconnaissance Vehicles
04/17/2026 | BUSINESS WIRETeledyne Technologies Incorporated announced that Teledyne FLIR Defense has been awarded a contract worth more than $35 million by WB Electronics S.A. (part of the WB Group) to equip reconnaissance vehicles with TacFLIR® 280-HDEP medium range multi-spectral surveillance systems.
The Future of Reflow Soldering Is Here
04/16/2026 | Real Time with... APEX EXPOMichael Hanke discusses how Rehm Thermal Systems is revolutionizing thermal solutions in electronics assembly with their innovative flux-free, no-clean soldering process. This is truly a game changing process that eliminates chamber cleaning and streamlines production. Developed with paste suppliers, this advanced technology promises significant time and cost savings while ensuring high-quality results.
Indium Showcases Solder Alloy Reliability Research for Heterogeneous Integration at ICEP-HBS
04/15/2026 | Indium CorporationIndium Corporation Senior Global Product Manager, Semiconductor and Advanced Materials, Sze Pei Lim will present a collaborative International Electronics Manufacturing Initiative (INEMI) project comparing SnBi and SAC305 solder alloys for first-level interconnects in complex heterogeneous packages.
Carbice Awarded Multi-Million Dollar U.S. Navy Contract for Thermal Assembly Joint Technology
04/14/2026 | PRNewswireCarbice, a U.S.-based manufacturer and supplier of novel multifunctional assembly joint technologies, has been awarded a multi-million dollar contract by the U.S. Navy's Office of Naval Research.
Powering the Future: Why Thermal Management Defines the Future of Electronics
04/15/2026 | Brian Buyea -- Column: Powering the FutureEvery leap forward in electronics comes with a familiar consequence: heat. Whether it’s a power module driving an electric vehicle, a laser diode used in surgery, or a 5G amplifier operating in orbit, higher performance inevitably means higher temperatures. While engineers celebrate breakthroughs in speed, density, and power, none of those specifications matter if the system can’t keep cool long enough to perform reliably.