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Tower Semiconductor, the leading foundry for high-value analog semiconductor solutions, announced a strategic restructuring of its Japan operations, which are currently organized under TPSCo (a Japanese company held 51% by Tower and 49% by Nuvoton Technology Corporation Japan (NTCJ).

Wolfspeed Launches Next-Gen AI Data Center Packaging with 300mm SiC Technology

03/26/2026 | Wolfspeed
Wolfspeed, Inc. , a global leader in silicon carbide technology, announced that its 300 mm silicon carbide (SiC) technology platform could serve as a foundational materials enabler for advanced AI and high‑performance computing (HPC) heterogeneous packaging by the end of this decade.

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Coherent Expands Silicon Carbide Platform with 300mm Capability to Support Growing Demand of AI and Datacenters

12/04/2025 | Globe Newswire
Coherent Corp., a global leader in photonics, announced a major milestone in its next-generation 300mm silicon carbide (SiC) platform to address increasing thermal efficiency demands in AI datacenter infrastructure.

Imec Launches 300mm GaN Program to Develop Advanced Power Devices and Reduce Manufacturing Costs

10/13/2025 | Imec
Imec, a world-leading research and innovation hub in nanoelectronics and digital technologies, welcomes AIXTRON, GlobalFoundries, KLA Corporation, Synopsys, and Veeco as first partners in its 300mm gallium-nitride (GaN) open innovation program track for low- and high-voltage power electronics applications.
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