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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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Real Time with... productronica 2025: The Versatility of Electroplating Technology With GreenSource
December 1, 2025 | Real Time with...productronicaEstimated reading time: Less than a minute
Gustavo Ramos from GreenSource Engineering shares insights on an innovative electroplating module. This system features high current density and adaptable chemistry, making it suitable for a range of applications. The focus is on developing a flexible process that can handle various product mixes and technologies, enhancing efficiency and versatility in electroplating.
Click here, or the image below, to watch the interview.
For our full coverage of productronica 2025, visit the Real Time with... productronica event site, located here.
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Real Time with... productronica 2025: Jiva's Product Progress Update
12/11/2025 | Real Time with...productronicaJiva’s Jack Herring provides an update on products, scalability, and lifecycle assessments. He answers questions about material properties, compliance, and sustainability. Jack also highlights the importance of being a market option and discusses plans for scaling production in the UK and Asia to meet demands and reduce carbon footprints.
Real Time with... productronica 2025: MKS' Atotech's Innovations in Sustainable Practices for the Chemical Industry
12/11/2025 | Real Time with...productronicaMKS' Atotech's Dr. Christian Ohde discusses environmental issues in the chemical industry. This interview explores sustainable materials, while emphasizing the reduction of harmful substances. With the shift toward eco-friendly practices, new technologies are needed to meet market demands and enhance efficiency in chip packaging.
Real Time with... productronica 2025: Navigating Changes in the EMEA Market—Insights from Ventec Experts
12/10/2025 | Real Time with...productronicaVentec's Mark Goodwin and Pesh Patel explore the EMEA market's structural changes, including Panasonic's factory closure and its effects on laminators. They discuss the transition to low DK glass and the influence of the AI boom. Mark highlights the need for effective inventory management, while Pesh presents the glass-free revolution, showcasing new materials and resin technologies that improve performance and expand applications beyond traditional circuit boards.
Real Time with... productronica 2025: Navigating Management Changes and Innovation at Koh Young
12/09/2025 | Real Time with...productronicaMarcy LaRont introduces Koh Young's team and discusses recent management changes, including the transition from a long-serving general manager. Solin Ahmad and Michael Zahn highlight their collaborative approach to decision-making while addressing challenges in European and African markets. They focus on tailored strategies and the role of AI in enhancing customer operations and product quality, inviting customers to explore their innovations at the show.
Real Time with... productronica 2025: Rehm's Innovations in Green Technology
12/08/2025 | Real Time with...productronicaMarcy LaRont introduces Michael Hanke at the Rehm booth, where they highlight the busy atmosphere and innovative machines. They discuss the new reflow soldering, formic acid integration, and the machine's efficiency. The focus is on green technology, data reporting, and software integration, including AI components.