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CMMC 2.0: What You Need to Know
December 29, 2025 | Marcy LaRont, PCB007 MagazineEstimated reading time: 1 minute
Tenets of the Department of Defense's (DoD) Cybersecurity Maturity Model Certification Program (CMMC) 2.0 went into effect on Nov. 10. What are the primary differences between 1.0 and 2.0 compliance, and what exactly must be in place now?
CMMC 2.0 is now being written into DoD contracts and enforced through DFARS (Defense Federal Acquisition Regulation Supplement), with a three-year phased rollout. For PCB and electronics manufacturers in the defense supply chain, this is now a real gate to doing business with the DoD, not a “nice to have.”
About CMMC
According to the Department of Defense (Department of War) Chief Information Officer (DODCIO), “Cybersecurity is a top priority for the DoD. The defense industrial base (DIB) faces increasingly frequent and complex cyber-attacks. To strengthen DIB cybersecurity and better protect DoW information, the Department developed the CMMC Program, which assesses defense contractor compliance with existing information safeguarding requirements for federal contract information (FCI) and controlled unclassified information.”
A Look Back: CMMC 1.0
CMMC Version 1.0, issued in early 2020, created a five-level maturity model with 17 domains and 171 practices, ranging from basic cyber hygiene to advanced/progressive security. Every contractor, including small manufacturers, was expected to obtain a third-party certification at the level specified by their contract.
Although the framework was detailed, it proved to be heavy and expensive, especially for small and mid-sized manufacturers, and was never fully implemented in contracts at scale. This experience directly informed the redesign of CMMC 2.0.
To read the entire article, which originally appeared in the December 2025 edition of PCB007 Magazine, click here.
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American Made Advocacy: Rebuilding America’s Military Stockpiles Begins With Microelectronics
04/28/2026 | Shane Whiteside -- Column: American Made AdvocacyCurrent world events demonstrate the fragility of long-distance supply chains transiting multiple zones of conflict. The U.S. military is currently drawing down supplies of key munitions and other electronic systems at unprecedented rates.1Every one of those systems is powered by printed circuit boards. The American PCB industry has kept pace with peacetime demand for the defense industry, but will now be called upon to increase production to a wartime footing at rates not seen in decades.
Remtec to Showcase Advanced Ceramic Technologies and Present Thermal Management for High-Power Applications at CMSE 2026
04/23/2026 | RemtecRemtec, a global leader in advanced ceramic substrates and microelectronic assembly solutions, today announced that President and CEO Brian Buyea will lead the company’s participation at Components for Military & Space Electronics Conference & Exhibition (CMSE 2026).
Lockheed Martin Wins Navy Contract for PAC-3 MSE Aegis Integration
04/23/2026 | Lockheed MartinThe U.S. government announced a contract with Lockheed Martin for the development, integration and testing of PAC-3® Missile Segment Enhancement (MSE) into the Aegis Combat System.
Scanfil Q1 2026: Solid Start with Significant Growth in Turnover and Profit
04/23/2026 | ScanfilScanfil opens its landmark 50th anniversary year on a high note, posting a 19.0% rise in turnover to EUR 229.1 million and a 24.1% jump in comparable EBITA in Q1 2026, backed by healthy organic growth and two game-changing acquisitions that have taken the company to an entirely new scale.
OE‑A Publishes 10th Edition of the Roadmap for Flexible and Printed Electronics
04/22/2026 | OE-AWith the publication of the 10th edition of the “OE-A Roadmap for Flexible and Printed Electronics,” the OE-A, an international working group for printed electronics within the VDMA, once again presents the central guidance and reference document for the industry.