-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current Issue
Wire Harness Solutions
Explore what’s shaping wire harness manufacturing, and how new solutions are helping companies streamline operations and better support EMS providers. Take a closer look at what’s driving the shift.
Spotlight on Europe
As Europe’s defense priorities grow and supply chains are reassessed, industry and policymakers are pushing to rebuild regional capability. This issue explores how Europe is reshaping its electronics ecosystem for a more resilient future.
APEX EXPO 2026 Preshow
This month, we take you inside the annual trade show of the Global Electronics Association, to preview the conferences, standards, keynotes, and other special events new to the show this year.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
New SASinno Ultra-i1 Gives K&F Electronics Added Flexibility in Selective Soldering
February 16, 2026 | K&F ElectronicsEstimated reading time: 1 minute
K&F Electronics, a third-generation, family-owned electronics assembly provider, has installed a SASinno Ultra-i1 offline selective soldering system, expanding its selective soldering capacity and improving process consistency for customer programs that require precise, repeatable results.
Founded in 1972, K&F Electronics has evolved into a long-established U.S. provider of electronic assembly services, supporting customers across a range of industries with reliable, high-quality builds. The addition of the Ultra-i1 allows K&F to handle a broader mix of board designs, lot sizes, and production schedules while maintaining quality and delivery expectations.
The SASinno Ultra Series, which includes the Ultra-i1 and Ultra-i2 models, is designed for operations with frequent changeovers and mixed production runs. The Ultra-i1 installed at K&F provides controlled selective soldering for small- to medium-batch production without slowing overall throughput.
Key features of the system include fiducial recognition, jet fluxing, automatic nozzle cleaning, and dual preheating zones to support stable soldering conditions. A maintenance-free electromagnetic pump and nitrogen heating help deliver consistent solder quality across production runs.
System operation and setup are managed through a Windows-based interface, with tools such as live soldering cameras, wave height calibration, and barcode tracking to support process verification and documentation.
“This addition gives us greater control over selective soldering and more flexibility for the mix of programs we support,” said Sean Kincaid, President of K&F Electronics. “It helps us respond quickly to new requirements while maintaining the level of quality our customers rely on.” The Ultra-i1 installation reflects K&F Electronics’ continued investment in equipment that strengthens process reliability and supports customer schedules.
Testimonial
"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."
Simon Khesin - Schmoll MaschinenSuggested Items
Driving Innovation: Selecting the Right Laser Source
04/28/2026 | Simon Khesin -- Column: Driving InnovationWhen I first joined Schmoll Maschinen, I brought experience from almost every PCB process, except for laser. As I immersed myself in laser processing, I realized why it can seem so daunting to a newcomer. The complexity arises from three intersecting factors: A vast variety of laser sources: CO2, UV-nano, green-pico, UV-pico, IR-pico, and others; a diverse range of applications: Drilling, cutting, ablation, and more; and an extensive list of materials: These have vastly different absorption rates. Choosing the right machine or laser source is rarely trivial. Even for experienced engineers, answering "Which source is best?" requires examining the business's specific goals.
CIL Joins EU Project OSYRYS to Bring Hybrid-electric for Regional Flight Closer to Reality
03/24/2026 | CILWhat if the future of regional flight was hybrid-electric—and closer than you think? CIL joins a diverse group of 24 EU industrial, research, and academic partners to make it reality.
DigiKey Collaborates with STMicroelectronics and Ultra Librarian to Deliver Enhanced eDesignSuite Integration
03/20/2026 | PRNewswireDigiKey, the global distribution leader of electronic components and automation products, announces the availability of an enhanced eDesignSuite experience, developed through a collaboration with STMicroelectronics (ST) and Ultra Librarian.
STMicroelectronics Advances Ultra-Wideband for Automotive and Smart Devices
03/13/2026 | STMicroelectronicsSTMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, introduces an ultra-wideband (UWB) chip family that comprehensively supports the next-generation wireless standard for localizing and tracking devices at distances up to several hundred meters.
IC Substrates vs. UHDI: The Future of Interconnect
03/15/2026 | Marcy LaRont, I-Connect007Advanced packaging is driving feature sizes below 50 microns, forcing IC substrates and UHDI PCBs into overlapping territory. Following his presentation at the Pan-European Design Conference (PEDC) in January, Jan Pedersen, director of technology at NCAB Group, spoke with us about how heterogeneous integration, evolving HDI roadmaps, and supply chain pressures are shaping the next phase of advanced packaging.