SIA Statement on Chip Security Act
March 3, 2026 | SIAEstimated reading time: Less than a minute
The Semiconductor Industry Association (SIA) released the following statement from President and CEO John Neuffer opposing the Chip Security Act (S. 1705/H.R. 3447).
“SIA members are fully committed to complying with export controls, and we strongly oppose the illicit diversion and misuse of our chip technologies. While we understand policymakers’ interest in addressing this issue, we cannot support blanket mandates for new, untested, and potentially infeasible on-chip mechanisms, such as what is being proposed in the Chip Security Act. Rushing to legislate complex, costly, and unproven security features risks undermining global trust in American semiconductor technologies and efforts to promote the export of the American AI technology stack, eroding our global leadership and competitiveness.
“Our companies work closely with government agencies, law enforcement, and other relevant stakeholders to prevent and detect illegal diversion and misuse of our products. We stand ready to engage with Congress to explore approaches to effectively address these risks, and to ensure American semiconductor technologies lay at the foundation of the global AI ecosystem.”
Subscribe
Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.Subscribe now to stay informed, competitive, and connected.
Suggested Items
POLYN Technology Announces Tapeout of Automotive Chip
04/30/2026 | BUSINESS WIREPOLYN Technology, a leader in neuromorphic technology with application-specific Neuromorphic Analog Signal Processing (NASP) products, has taped out a VibroSense™ engineering chip featuring an analog neuromorphic core for tire friction monitoring.
AI Competition Turns into a Supply Chain Arms Race, Tightening Advanced Packaging and 3nm Capacity
04/30/2026 | TrendForceTrendForce’s latest foundry industry findings point out that AI demand has surged rapidly since 2023, leading to capacity bottlenecks in 3 nm–2 nm wafers and 2.5D/3D advanced packaging.
EDADOC: Building the ‘Neural Hub’ for High-Compute Chips Within a Compact Space
04/28/2026 | ECIOEvery chip to the market must pass a stringent checkpoint before shipment known as ATE testing. Serving as the physical “neural hub” that connects test equipment worth millions of dollars with the device under test, the performance of the ATE test board directly determines the accuracy, efficiency, and final yield of chip testing. Amid the rapid rise of high-compute chips, what extreme challenges is this seemingly small circuit board facing? How is EDADOC addressing industry pain points through its one-stop “design + manufacturing” model?
SEMI Europe Outlines Six Key Recommendations to Strengthen Chips Act 2.0
04/28/2026 | SEMISEMI Europe announced the publication of its Position Paper on the Chips Act 2.0, presenting a set of strategic recommendations aimed at reinforcing and future-proofing Europe’s semiconductor policy framework.
Global Direct-to-Cell Market to Grow 49% YoY in 2026, Unlocking New Supply Chain Opportunities
04/27/2026 | TrendForceDirect-to-Cell technology is rapidly maturing as global mobile communications standards 3GPP Release 17 and Release 18 continue to incorporate satellite communications.