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SMTA Announces Program for 2026 Ultra High Density Interconnect (UHDI) Symposium
March 20, 2026 | SMTAEstimated reading time: Less than a minute
The SMTA is excited to announce the technical program for the 3rd annual Ultra High Density Interconnect Symposium which takes place on April 9, 2026 in Avondale, Arizona, USA.
The program covers advancements in Ultra HDI across defense applications, fabrication technologies, materials, assembly processes, test development, research initiatives, and collaboration across the electronics manufacturing ecosystem.
This event sets the stage for researchers, engineers, designers and academia to address the complexities and innovations reshaping the world of Ultra HDI technology, which is producing printed circuit boards and semiconductors with lines and spaces well below 50 microns.
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