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Heat Dissipation in Design: Current and Future Challenges
January 5, 2009 |Estimated reading time: Less than a minute
Dissipation of heat generated due to power loss is a major packaging task. This voiceover presentation by Dr. Thomas Ahrens of the Fraunhofer Institute explains how to tailor components, modules and PCB elements for heat buffering, spreading, transfer and conduction. This presentation, given at EKTN's "Bending the Design Rules" conference in the UK, includes examples of heat dissipating elements, models describing the heat path and efficiency of various constructions, and testing of junction and integrity of the elements.
Click here to watch.