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Verdant Names Occam Development Partners
October 31, 2007 |Estimated reading time: Less than a minute
SAN JOSE, Calif. At the Occam Process Developers Meeting in October, Verdant Electronics established principle agreements with three partners for developing the Occam solderless interconnect technology.
Promex Industries, a Silicon Valley microelectronics assembly company; Micropress, a PCB fabricator (Sao Paulo, Brazil); and Hunter Technology Group, also located in the Silicon Valley, signed on to promote the process and work with OEMs to develop products based on the reverse-interconnect Occam technology.
These companies are building Occam prototype products for demonstration, qualifying the process with customers, and promoting the concept, said Joe Fjelstad, president, Verdant.
Promex is completing its first set of process manufacturing runs, said Dick Otte, president of Promex, citing reduced complexity and cost and increased flexibility as reasons for adoption. He anticipates process improvements as test results and prototypes come in. Micropress plans to market the process in South America, according to Gilmar Aparecido de Souza, president. He plans to have Occam "fabsemblies" completed within a few months. Joe O'Neil, president of Hunter Technology, will explore benefits for military and medical customers, with Occam as a high-reliability alternative assembly process.
For more information, visit www.verdantelectronics.com.